OR3T207S208-DB

The OR3T207S208-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC offering 1152 logic elements, 171 general-purpose I/O pins and 18,432 bits of on-chip RAM. Designed as a compact, surface-mount FPGA, it targets designs that require moderate logic capacity and a high I/O count within a commercial-temperature operating range.

Key value propositions include a balance of logic resources, embedded memory and a 208-pin BFQFP package that supports dense I/O implementations while operating from a 3.0 V to 3.6 V supply.

Key Features

• Core Logic  1,152 logic elements and an estimated 36,000 gates provide the programmable fabric for combinational and sequential logic implementations.
• Embedded Memory  18,432 bits of on-chip RAM for small data buffers, state storage and lookup tables.
• I/O Capacity  171 user I/O pins support high pin-count interfacing for multiple external peripherals and signals.
• Package and Mounting  208-BFQFP surface-mount package (supplier device package: 208-SQFP, 28×28) enables dense PCB routing for compact systems.
• Power  Single-supply operation from 3.0 V to 3.6 V simplifies power-rail planning for 3 V-class systems.
• Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 70 °C for standard ambient environments.
• Compliance  RoHS-compliant material composition supports modern environmental requirements.

Typical Applications

• Prototyping and Development  Use the OR3T207S208-DB for building and iterating medium-complexity programmable logic designs that require up to 1,152 logic elements and substantial I/O.
• Embedded Control  Suitable for embedded controller functions where local RAM (18,432 bits) and 171 I/Os are needed to interface sensors, actuators and peripheral devices.
• I/O Expansion and Glue Logic  Ideal for implementing glue logic, I/O aggregation or protocol bridging tasks that demand flexible pin assignments and programmable logic.

Unique Advantages

• High I/O Count in a Compact Footprint: 171 I/Os in a 208-pin BFQFP package provide extensive interfacing capability without requiring a larger package family.
• Balanced Logic and Memory: 1,152 logic elements combined with 18,432 bits of embedded RAM support a range of medium-complexity functions and small data buffering.
• Simplified Power Integration: Operates from a single 3.0 V–3.6 V supply, easing power-rail design for 3 V systems.
• Surface-Mount Convenience: Surface-mount 208-BFQFP packaging (supplier device package: 208-SQFP, 28×28) supports automated PCB assembly and compact board layouts.
• Commercial-Grade Reliability: Rated for 0 °C to 70 °C operation and RoHS-compliant, making it suitable for standard commercial electronic products and production environments.

Why Choose OR3T207S208-DB?

The OR3T207S208-DB provides a practical mix of logic capacity, embedded RAM and a high I/O count in a compact surface-mount package, addressing designs that need flexible programmable logic without excessive footprint or power complexity. Its 3.0 V–3.6 V supply range and commercial operating temperature make it a straightforward choice for mainstream embedded systems and board-level integration.

Engineers and procurement teams looking for a RoHS-compliant, commercially graded FPGA with clear, verifiable resource specifications will find the OR3T207S208-DB appropriate for medium-complexity implementations where 1,152 logic elements, 18,432 bits of RAM and 171 I/Os meet design requirements.

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