OR3T306S208-DB

The OR3T306S208-DB is an ORCA® Series 3T Field Programmable Gate Array from Lattice Semiconductor, provided in a 208-BFQFP (208-PQFP, 28×28) surface-mount package. It implements the Series 3 architecture using OR3T technology and delivers a balanced combination of logic capacity, on-chip RAM and flexible I/O for commercial embedded designs.

Targeted at commercial-grade applications, this device offers 1,568 logic elements, approximately 25,600 bits of embedded RAM and 171 user I/Os, enabling mid-density logic integration and mixed-voltage I/O interfacing in a single-package FPGA.

Key Features

• Logic Capacity — 1,568 logic elements supporting a total gate-equivalent count of approximately 48,000 gates for mid-density logic implementations.
• Embedded Memory — Total on-chip RAM of 25,600 bits for localized data buffering, state storage and small lookup tables.
• Rich I/O — 171 user I/O pins with OR3T-series 5 V tolerance and pin-selectable clamping options for 3.3 V or 5 V compatibility as described in the Series 3T documentation.
• Configurable I/O Drive — Individually programmable drive strength options documented for Series 3 devices (12 mA sink/6 mA source or 6 mA sink/3 mA source) to match board-level signalling requirements.
• Package and Mounting — 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28) for straightforward PCB integration.
• Power and Temperature — Single VCC operating range from 3.0 V to 3.6 V; commercial operating temperature range of 0 °C to 70 °C.
• On‑chip Test and Clocking — Series 3 devices include boundary-scan (IEEE 1149.1 JTAG) and enhanced system clock routing features described in the ORCA Series documentation for low-skew clock distribution.

Typical Applications

• Mixed‑Voltage Interface Systems — Per-pin 5 V-tolerant I/Os and pin-selectable clamping make the device suitable for designs requiring connections between 3.3 V and legacy 5 V peripherals.
• Mid‑Density Logic Integration — With 1,568 logic elements and approximately 48,000 gate equivalents, the device is suited for glue-logic consolidation, protocol bridging and control logic.
• Embedded Control and I/O Management — Abundant user I/Os and configurable drive strengths support user-interface control, peripheral interfacing and on-board sequencing tasks in commercial equipment.

Unique Advantages

• Balanced Resource Set: Combines logic (1,568 elements), embedded RAM (25,600 bits) and 171 I/Os to reduce external components and simplify system architecture.
• Flexible I/O Options: Per-pin 5 V tolerance and selectable clamping support mixed-voltage systems without requiring level-shifters on every signal.
• Compact Surface‑Mount Package: 208-BFQFP (28×28 PQFP footprint) enables a high-pin-count solution in a standard PCB assembly flow.
• Commercial Temperature Suitability: Rated for 0 °C to 70 °C operation to match a wide range of commercial embedded applications.
• Standard Voltage Supply: Operates from 3.0 V to 3.6 V, matching common board power rails for simplified power design.

Why Choose OR3T306S208-DB?

The OR3T306S208-DB provides a practical balance of logic density, on-chip RAM and extensive I/O in a familiar 208‑pin PQFP package for commercial embedded designs. Its Series 3T feature set—documented 5 V-tolerant I/Os, configurable drive strength, boundary-scan capability and enhanced clock routing—makes it a suitable option when designers need mid-density FPGA resources and flexible interfacing in a single device.

This part is appropriate for teams aiming to consolidate discrete logic, implement protocol bridging or manage I/O-rich control functions while staying within commercial temperature and voltage domains. The device’s resource mix and package options offer a clear upgrade path within the ORCA Series 3 family for scalable design reuse.

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