OR3T306BA256-DB

The OR3T306BA256-DB is a commercial-grade ORCA® Series 3T Field Programmable Gate Array (FPGA) offered in a 256‑ball BGA package. It implements the Series 3T architecture and provides a mid-density logic fabric with on-chip embedded memory and extensive I/O to support system-level integration.

With 1,568 logic elements, 221 user I/Os and support for 3.0–3.6 V operation, this device is suited for commercial embedded applications requiring flexible I/O interfacing, moderate logic capacity and compact board-level integration.

Key Features

• Core architecture ORCA® Series 3T FPGA architecture based on the Series 3 family as documented in the device datasheet, implemented in 0.3 μm, 4‑level metal technology.
• Logic capacity 1,568 logic elements enabling approximately 48,000 usable gates for mid-density logic integration.
• Embedded memory Approximately 0.0256 Mbits of embedded memory (25,600 bits) for on-chip storage and buffering.
• I/O and voltage flexibility 221 user I/Os with OR3T-series capabilities for 5 V tolerance and pin-selectable I/O clamping diodes to support 3.3 V or 5 V signaling environments.
• Power and supply Single-supply operation from 3.0 V to 3.6 V to match common commercial system rails.
• Package and mounting 256‑BGA (supplier package: 256‑FPBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB designs.
• Clocking and timing Enhanced system clock routing and multiple fast clock input features described for the ORCA Series 3 family to support low-skew clock distribution and high-speed on-/off-chip clocking.
• Testability and system integration Built-in boundary-scan (IEEE 1149.1 JTAG) and test functions for in-system test and board-level diagnostics.
• Operating range Commercial operating temperature from 0 °C to 70 °C.
• Regulatory RoHS compliant.

Typical Applications

• System I/O bridging Use the 221 I/Os and OR3T-series 5 V tolerance to interface between 3.3 V and 5 V peripherals and legacy devices.
• Embedded control and glue logic Implement mid-density control logic, protocol handlers, and glue logic between processors, sensors and peripherals.
• Prototyping and evaluation Compact 256‑BGA package and moderate logic capacity make the device suitable for proof-of-concept and prototype boards in a commercial design context.

Unique Advantages

• Balanced logic and I/O mix: 1,568 logic elements combined with 221 user I/Os provide a practical balance for designs that need both on-chip logic and extensive external connectivity.
• Flexible voltage interfacing: OR3T-series I/O options and pin-selectable clamping simplify mixed-voltage system integration without additional level-shifting components.
• Compact board integration: 256‑BGA (17 × 17 mm) packaging supports high-density PCB layouts while keeping board area and BOM count low.
• On-chip memory for buffering: Embedded RAM (25,600 bits) enables local storage for FIFOs, small buffers, and state machines, reducing external memory dependence.
• Design for testability: Built-in IEEE 1149.1 JTAG boundary-scan enhances manufacturing test coverage and simplifies board bring-up.

Why Choose OR3T306BA256-DB?

The OR3T306BA256-DB offers a mid-range ORCA® 3T FPGA solution combining 1,568 logic elements, substantial I/O availability and embedded memory in a compact 256‑BGA package. Its 3.0–3.6 V supply range, commercial temperature grade and OR3T-series I/O features make it a practical choice for commercial embedded designs that require flexible interfacing and reliable on-chip resources.

This device is well suited for engineering teams looking to integrate moderate complexity logic, perform protocol bridging, or prototype mixed-voltage systems while maintaining a compact PCB footprint and RoHS compliance.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the OR3T306BA256-DB.