OR3T307BA256-DB

The OR3T307BA256-DB is a commercial-grade ORCA® Series 3T FPGA in a 256-BGA package designed for cost-effective, flexible logic integration. It combines 1,568 logic elements, approximately 0.0256 Mbits of embedded RAM (25,600 bits), and 221 user I/Os to support mid-density digital designs in commercial embedded systems, communications equipment, and consumer electronics.

Built on the ORCA Series 3 architecture, this device offers a balance of programmable logic, on-chip memory, and I/O flexibility with support for 3.0–3.6 V supply operation and surface-mount 256-FPBGA (17×17) packaging.

Key Features

• Core Logic  1,568 logic elements and approximately 48,000 equivalent gates provide mid-range programmable logic capacity for combinational and sequential functions.
• Embedded Memory  Approximately 0.0256 Mbits of on-chip RAM (25,600 bits) for data buffering, state storage, and small memory structures.
• I/O and Voltage Flexibility  221 user I/Os with OR3T-series per-pin options—OR3Txxx devices support 5 V tolerance and pin-selectable I/O clamping for 3.3 V or 5 V interfacing and PCI compliance options.
• Clocking and Timing  Enhanced system clock routing with support for multiple high-speed clock inputs and features such as ExpressCLK and StopCLK enable flexible low-skew clock distribution (series-level feature).
• On-chip Testability  Built-in boundary scan (IEEE 1149.1 JTAG) and TS_ALL testability support simplify board-level bring-up and manufacturing test.
• Drive and I/O Control  Individually programmable drive strength options (12 mA sink/6 mA source or 6 mA sink/3 mA source) help match board-level signaling and loading requirements.
• Package & Mounting  256-BGA (supplier package: 256-FPBGA, 17×17) surface-mount package for compact board integration.
• Power and Temperature  Operates from 3.0 V to 3.6 V supply and rated for commercial operating temperatures from 0 °C to 70 °C.
• Compliance  RoHS compliant.

Typical Applications

• Embedded Control  Use the OR3T307BA256-DB for mid-density control logic and glue-logic in commercial embedded platforms where moderate logic density and flexible I/O are required.
• Communications Equipment  Implement protocol handling, interface bridging, and custom packet processing leveraging the device’s sizable I/O count and programmable logic resources.
• Consumer Electronics  Integrate custom user interface handling, peripheral control, and signal routing in compact BGA footprints for consumer devices.
• Instrumentation & Test  Deploy for onboard sequencers, simple data aggregation, and test control where JTAG boundary-scan and on-chip RAM are useful for validation and diagnostics.

Unique Advantages

• Balanced Logic and Memory: 1,568 logic elements paired with 25,600 bits of embedded RAM deliver a practical balance of combinational logic and small on-chip storage for mid-range designs.
• High I/O Density: 221 user I/Os enable connectivity to multiple peripherals and interfaces without external bus glue logic.
• Flexible Voltage Interfacing: OR3T-series 5 V-tolerant I/Os and pin-selectable clamping allow simple interoperation with both 3.3 V and 5 V subsystems.
• Compact Surface-Mount Package: 256-FPBGA (17×17) provides a space-efficient footprint for PCB layouts while maintaining a generous pin count.
• Design for Manufacturing: Integrated IEEE 1149.1 JTAG boundary-scan and device-level testability simplify board-level testing and reduce debug time.
• Commercial Temperature and Supply Range: Operates across a standard 0 °C to 70 °C commercial range and 3.0–3.6 V supplies, aligning with mainstream commercial product requirements.

Why Choose OR3T307BA256-DB?

The OR3T307BA256-DB is positioned for designers seeking a commercially rated, mid-density FPGA solution that combines a practical logic element count, on-chip memory, and a high I/O count in a compact BGA package. Its ORCA Series 3T heritage brings architecture features such as flexible I/O tolerance, enhanced clock routing, and built-in testability to streamline system integration and board-level validation.

This device suits commercial embedded systems, communications equipment, and consumer applications where moderate programmable logic, flexible interfacing, and compact packaging deliver long-term value through simplified BOMs and reduced external glue logic.

Request a quote or submit your project requirements to receive pricing and availability information for the OR3T307BA256-DB.