OR3T556PS240-DB

The OR3T556PS240-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides 2,592 logic elements and 43,008 bits of on-chip RAM in a 240-BFQFP exposed pad surface-mount package for commercial-grade electronic designs.

Designed for commercial applications that require moderate-density programmable logic and flexible I/O, this device delivers a balance of integration, I/O count, and on-chip memory within a single 3.0–3.6 V device rated for 0 °C to 70 °C operation.

Key Features

• Logic Capacity — 2,592 logic elements providing programmable fabric for implementing custom logic and state machines.
• Embedded Memory — 43,008 bits of on-chip RAM enabling storage for buffering, lookup tables, and small data structures.
• I/O Support — 192 I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Gate Equivalent — Approximately 80,000 gates of logic equivalence for mapping complex combinational and sequential functions.
• Power — Operates from a 3 V to 3.6 V supply range to match common commercial power domains.
• Package — 240-BFQFP exposed pad surface-mount package (supplier device package: 240-SQFP2, 32×32) for thermal relief and compact board integration.
• Operating Range — Commercial temperature rating from 0 °C to 70 °C, suitable for standard consumer and commercial environments.
• RoHS Compliant — Device is RoHS compliant, meeting common environmental requirements for electronics assembly.

Typical Applications

• Commercial Electronics — Implement control logic, glue logic, and custom interfaces in consumer and commercial devices where a moderate-density FPGA is required.
• User Interface Control — Manage display drivers, button scanning, and peripheral multiplexing using available I/O and embedded memory for buffering.
• Peripheral Bridging — Aggregate and translate signals between multiple subsystems using the device’s 192 I/O pins and programmable logic.

Unique Advantages

• Balanced Logic and Memory: 2,592 logic elements combined with 43,008 bits of RAM let designers implement both control and small data-path functions on a single device, reducing external components.
• High I/O Count: 192 I/O pins provide wide connectivity options for interfacing with multiple peripherals and board-level signals.
• Compact, Thermally Aware Package: The 240-BFQFP exposed pad package supports surface-mount assembly while offering an exposed pad for improved board-level thermal performance.
• Commercial Voltage and Temperature: Operates on a 3 V to 3.6 V supply and is specified for 0 °C to 70 °C, aligning with common commercial product requirements.
• Environmentally Compliant: RoHS compliance simplifies integration into assemblies that must meet environmental regulations.

Why Choose OR3T556PS240-DB?

The OR3T556PS240-DB delivers a practical combination of logic capacity, on-chip RAM, and extensive I/O in a single commercial-grade FPGA package. It is well suited to designers who need moderate-density programmable logic and flexible connectivity while maintaining a compact board footprint.

For teams building consumer or commercial electronic products, this ORCA™3C device provides a scalable, integrated building block that streamlines design by consolidating control, interfacing, and buffering tasks into one programmable IC from Lattice Semiconductor.

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