OR3T556PS240I-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 192 43008 2592 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 101 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-SQFP2 (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 192 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 324 | Number of Logic Elements/Cells | 2592 | ||
| Number of Gates | 80000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 43008 |
Overview of OR3T556PS240I-DB – ORCA™3C FPGA, 240-BFQFP Exposed Pad
The OR3T556PS240I-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This industrial-grade, surface-mount FPGA delivers 2,592 logic elements, approximately 43,008 bits of embedded memory and up to 192 I/Os in a 240-BFQFP exposed pad package.
Designed for applications requiring moderate logic density, on-chip RAM and a broad I/O count, the device operates from a 3 V to 3.6 V supply and supports an operating temperature range of −40 °C to 85 °C.
Key Features
- Core Logic Provides 2,592 logic elements to implement custom digital logic and control functions.
- Embedded Memory Includes approximately 43,008 bits of on-chip RAM for buffering, small FIFOs and state storage.
- I/O Capacity Offers 192 I/O pins to support a wide range of external interfaces and parallel connectivity.
- Gate Equivalent Approximately 80,000 gates of logic capacity for mixed control and glue-logic tasks.
- Package & Mounting 240-BFQFP exposed pad package (supplier device package: 240-SQFP2, 32×32) with surface-mount construction for board-level integration and thermal management.
- Power Operates from a 3 V to 3.6 V supply, enabling compatibility with common 3 V systems.
- Industrial Grade & Temperature Specified for industrial operation with an operating temperature range of −40 °C to 85 °C.
Unique Advantages
- Significant Logic Capacity: 2,592 logic elements provide headroom for custom logic, protocol handling and control functions without external glue logic.
- On-chip Memory: Approximately 43,008 bits of embedded RAM reduce external memory needs for small buffers and state machines.
- High I/O Count: 192 I/Os support numerous peripherals and parallel interfaces, simplifying board routing and system integration.
- Industrial Temperature Range: Rated from −40 °C to 85 °C for deployment in temperature-variable environments.
- Exposed Pad Package: The 240-BFQFP exposed pad package aids thermal dissipation and supports reliable surface-mount assembly.
- Standard 3 V Supply: Operates on a 3 V to 3.6 V supply making it suitable for common 3 V system architectures.
Why Choose OR3T556PS240I-DB?
The OR3T556PS240I-DB balances moderate logic density, on-chip memory and a high I/O count in an industrial-grade, surface-mount package. Its combination of 2,592 logic elements, approximately 43,008 bits of embedded RAM and 192 I/Os makes it a practical choice for designers needing compact FPGA-based control, interfacing and glue-logic solutions within a 3 V system.
With an exposed pad 240-BFQFP package and an operating range of −40 °C to 85 °C, this device supports robust board-level thermal handling and industrial temperature operation, offering a reliable platform for mid-density FPGA designs.
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