OR3T556PS240I-DB

FPGA ORCA SERIES 3T FAMILY
Part Description

ORCA™3C Field Programmable Gate Array (FPGA) IC 192 43008 2592 240-BFQFP Exposed Pad

Quantity 101 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package240-SQFP2 (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O192Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs324Number of Logic Elements/Cells2592
Number of Gates80000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits43008

Overview of OR3T556PS240I-DB – ORCA™3C FPGA, 240-BFQFP Exposed Pad

The OR3T556PS240I-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This industrial-grade, surface-mount FPGA delivers 2,592 logic elements, approximately 43,008 bits of embedded memory and up to 192 I/Os in a 240-BFQFP exposed pad package.

Designed for applications requiring moderate logic density, on-chip RAM and a broad I/O count, the device operates from a 3 V to 3.6 V supply and supports an operating temperature range of −40 °C to 85 °C.

Key Features

  • Core Logic  Provides 2,592 logic elements to implement custom digital logic and control functions.
  • Embedded Memory  Includes approximately 43,008 bits of on-chip RAM for buffering, small FIFOs and state storage.
  • I/O Capacity  Offers 192 I/O pins to support a wide range of external interfaces and parallel connectivity.
  • Gate Equivalent  Approximately 80,000 gates of logic capacity for mixed control and glue-logic tasks.
  • Package & Mounting  240-BFQFP exposed pad package (supplier device package: 240-SQFP2, 32×32) with surface-mount construction for board-level integration and thermal management.
  • Power  Operates from a 3 V to 3.6 V supply, enabling compatibility with common 3 V systems.
  • Industrial Grade & Temperature  Specified for industrial operation with an operating temperature range of −40 °C to 85 °C.

Unique Advantages

  • Significant Logic Capacity: 2,592 logic elements provide headroom for custom logic, protocol handling and control functions without external glue logic.
  • On-chip Memory: Approximately 43,008 bits of embedded RAM reduce external memory needs for small buffers and state machines.
  • High I/O Count: 192 I/Os support numerous peripherals and parallel interfaces, simplifying board routing and system integration.
  • Industrial Temperature Range: Rated from −40 °C to 85 °C for deployment in temperature-variable environments.
  • Exposed Pad Package: The 240-BFQFP exposed pad package aids thermal dissipation and supports reliable surface-mount assembly.
  • Standard 3 V Supply: Operates on a 3 V to 3.6 V supply making it suitable for common 3 V system architectures.

Why Choose OR3T556PS240I-DB?

The OR3T556PS240I-DB balances moderate logic density, on-chip memory and a high I/O count in an industrial-grade, surface-mount package. Its combination of 2,592 logic elements, approximately 43,008 bits of embedded RAM and 192 I/Os makes it a practical choice for designers needing compact FPGA-based control, interfacing and glue-logic solutions within a 3 V system.

With an exposed pad 240-BFQFP package and an operating range of −40 °C to 85 °C, this device supports robust board-level thermal handling and industrial temperature operation, offering a reliable platform for mid-density FPGA designs.

Request a quote or submit an inquiry to purchase the OR3T556PS240I-DB and include your required quantity and delivery timeframe for prompt assistance.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up