OR3T556BA256-DB
| Part Description |
ORCA® 3 Field Programmable Gate Array (FPGA) IC 223 43008 2592 256-BGA |
|---|---|
| Quantity | 1,410 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 223 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 324 | Number of Logic Elements/Cells | 2592 | ||
| Number of Gates | 80000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 43008 |
Overview of OR3T556BA256-DB – ORCA® 3 Field Programmable Gate Array (FPGA), 256‑BGA
The OR3T556BA256-DB is a commercial-grade ORCA® Series 3T field programmable gate array (FPGA) offered in a 256‑BGA package. It delivers reconfigurable logic and flexible I/O for commercial embedded and digital designs where moderate logic capacity, plentiful I/O and on‑chip memory are required.
Based on the ORCA Series 3T architecture, this device supports fast LUT-based logic, robust routing and per-pin I/O configuration options, enabling mixed-signal interfacing and system glue logic in a single programmable device.
Key Features
- Logic Capacity 2,592 logic elements (cells) with a reported equivalent of 80,000 gates, suitable for medium-complexity logic functions and glue logic.
- Embedded Memory 43,008 bits of on-chip RAM—approximately 0.043 Mbits—supporting local storage and small data buffering.
- I/O Density & Flexibility 223 user I/Os provide extensive peripheral and bus connectivity. OR3T-series devices offer per-pin selectable I/O behavior including 5 V tolerance and pin-selectable I/O clamping diodes for 3.3 V or 5 V PCI compliance (series feature).
- ORCA 3T Architecture Series 3T architecture with 0.3 µm process technology and LUT-based programmable function units, enabling mixed arithmetic and logic functions, fast-carry routing and hierarchical routing resources (series features).
- Package & Mounting 256‑BGA (supplier package: 256‑FPBGA 17×17) in a surface‑mount format for high I/O density in compact board layouts.
- Power & Voltage Single-supply operation from 3.0 V to 3.6 V, simplifying power-rail planning for 3.3 V systems.
- Operating Range & Compliance Commercial temperature grade with an operating range of 0 °C to 70 °C and RoHS compliance for environmental conformity.
Typical Applications
- Interface Bridging and Level Translation Use the OR3T556BA256-DB to implement glue logic and protocol bridging between 3.3 V and 5 V domains, leveraging per-pin I/O configuration and series 5 V tolerance.
- Embedded Control & Custom Logic Deploy as the central programmable logic element for control functions, state machines, and application-specific logic in commercial electronics.
- User Interface and Peripheral Management High I/O count supports driving or monitoring numerous buttons, LEDs, sensors and peripheral buses in compact board designs.
- Prototyping and System Integration Suitable for proof-of-concept and production-level implementations that require reconfigurable logic and moderate on-chip memory.
Unique Advantages
- High I/O Count: 223 user I/Os enable extensive external connectivity without additional interface chips, reducing BOM and board complexity.
- Moderate Logic & Memory Balance: 2,592 logic elements paired with ~0.043 Mbits of embedded RAM make it well-suited for medium-complexity designs that need local buffering and state storage.
- Flexible Voltage Support: 3.0 V–3.6 V supply wide enough for standard 3.3 V systems while OR3T-series I/O features support mixed-voltage interfacing.
- Compact, High‑Density Package: 256‑BGA (17×17 FPBGA) offers a small footprint with dense I/O, aiding space-constrained PCB layouts.
- RoHS Compliant: Environmentally compliant manufacturing helps meet regulatory and corporate sourcing requirements.
- Commercial Temperature Grade: Rated 0 °C to 70 °C for typical commercial applications and deployed environments.
Why Choose OR3T556BA256-DB?
The OR3T556BA256-DB combines the ORCA Series 3T FPGA architecture with a practical mix of logic resources, on-chip memory and a high number of configurable I/Os in a compact 256‑BGA package. It is positioned for commercial embedded designs that require reconfigurable logic, mixed-voltage interfacing and a balance between capacity and board footprint.
Designers seeking a commercially rated FPGA solution for interface bridging, custom control logic or dense I/O management will find the OR3T556BA256-DB a capable option that simplifies system design and reduces external component count.
Request a quote or submit an inquiry to evaluate OR3T556BA256-DB availability and pricing for your next design.