OR3T556BA352I-DB

The OR3T556BA352I-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates on-chip logic, memory, and a high I/O count in a compact 352-BBGA package for space-constrained designs.

With 2,592 logic elements, 43,008 bits of embedded RAM, up to 288 I/O pins and support for industrial temperature operation, this device is positioned for embedded and industrial applications that require moderate logic capacity, integrated memory and robust thermal range.

Key Features

• Core Logic — 2,592 logic elements and approximately 80,000 gates provide programmable logic resources for custom digital functions.
• Embedded Memory — 43,008 bits of on-chip RAM (approximately 0.043 Mbits) for buffering, state storage and small lookup tables.
• I/O Capacity — 288 configurable I/O pins to support a variety of external interfaces and peripherals.
• Power — Single supply operation from 3.0 V to 3.6 V to match common system rails.
• Package & Mounting — 352-BBGA package (supplier device package: 352-PBGA, 35 × 35 mm footprint) with surface-mount mounting type for dense board layouts.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 85 °C.

Unique Advantages

• Integrated logic and memory resources: 2,592 logic elements combined with 43,008 bits of RAM reduce the need for external components in mid-density designs.
• High I/O density: 288 I/O pins enable flexible connectivity options for peripheral interfaces without additional I/O expanders.
• Industrial temperature range: Rated from −40 °C to 85 °C for reliable operation across a wide set of environments.
• Compact BGA packaging: 352-BBGA (35 × 35) minimizes board area while delivering high pin count for complex designs.
• Single-supply flexibility: 3.0–3.6 V supply range simplifies power-rail design in systems using standard 3.3 V logic.

Why Choose OR3T556BA352I-DB?

The OR3T556BA352I-DB delivers a balanced combination of logic capacity, embedded memory and I/O density in an industrial-temperature, surface-mount BGA package. It is suited to engineers designing mid-density programmable logic solutions where board space, ambient temperature range and integration of memory and I/O are central design considerations.

Its specification set supports scalable designs that benefit from integrated resources and a compact footprint, providing a practical option for long-term deployments that require industrial-grade operating range and a well-defined set of on-chip resources.

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