OR3T557PS208-DB

The OR3T557PS208-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-range programmable logic resource suitable for commercial applications that require customizable digital logic, on-chip memory, and a substantial I/O count.

Key on-chip resources include 2,592 logic elements, approximately 0.043 Mbits of embedded memory, and 171 programmable I/O. The device is supplied in a 208-BFQFP exposed pad package and operates from a 3.0 V to 3.6 V supply over a commercial temperature range (0 °C to 70 °C).

Key Features

• Core Logic  2,592 logic elements (logic cells) providing the programmable fabric for implementing custom digital functions.
• Embedded Memory  Total on-chip RAM: 43,008 bits (approximately 0.043 Mbits) for user data and buffering needs.
• I/O and Pins  171 user I/O pins to support parallel interfaces, multiple signals, and board-level connectivity options.
• Gate Count  Approximately 80,000 gates for overall device complexity and logic capacity.
• Power and Supply  Single supply operation from 3.0 V to 3.6 V to match common commercial logic domains.
• Package and Mounting  208-BFQFP exposed pad package (supplier device package: 208-SQFP2, 28×28) intended for surface-mount assembly.
• Operating Range  Commercial grade operation specified from 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded Control  Use the OR3T557PS208-DB to implement custom control logic where 2,592 logic elements and on-chip RAM support state machines, control paths, and glue logic in commercial equipment.
• Interface Bridging  Leverage 171 I/O pins to bridge multiple parallel interfaces or multiplex signals between system components on commercial PCBs.
• Prototyping and Custom Logic  Suitable for development boards and prototypes that require reprogrammable logic and a mid-range gate count (~80,000 gates) for verification and iterative design.

Unique Advantages

• Balanced Logic Capacity:  2,592 logic elements deliver a mid-range resource set for implementing significant custom logic without the complexity of higher-tier devices.
• Generous I/O Count:  171 I/O pins provide flexibility for multi-signal interfaces and system integration, reducing the need for external I/O expanders.
• Compact Surface-Mount Package:  The 208-BFQFP exposed pad package supports surface-mount assembly while offering thermal conduction via the exposed pad.
• Commercial Voltage and Temperature:  3.0–3.6 V supply compatibility and 0 °C to 70 °C operation align the device with standard commercial electronic designs.
• RoHS Compliant:  Meets lead-free and environmental compliance expectations for commercial electronics.

Why Choose OR3T557PS208-DB?

The OR3T557PS208-DB positions itself as a practical, commercially graded FPGA option for designs needing a moderate amount of programmable logic, a sizable I/O complement, and on-chip RAM for buffering and small data storage. Its gate count and logic element capacity make it appropriate for custom control, interface logic, and prototyping in commercial product lines.

As an ORCA™3C device from Lattice Semiconductor Corporation, it suits teams and projects that require a commercially specified, RoHS-compliant FPGA in a 208-BFQFP exposed pad package with standard 3.0–3.6 V operation and 0 °C to 70 °C temperature rating.

Request a quote or submit a procurement inquiry to begin sourcing the OR3T557PS208-DB for your next commercial FPGA design.