OR3T806BA352-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 298 63488 3872 352-BBGA |
|---|---|
| Quantity | 481 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-PBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BBGA | Number of I/O | 298 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 484 | Number of Logic Elements/Cells | 3872 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 63488 |
Overview of OR3T806BA352-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC 298 63488 3872 352-BBGA
The OR3T806BA352-DB is a Field Programmable Gate Array (FPGA) integrated circuit from Lattice Semiconductor Corporation. It provides a mid-range programmable-logic resource set, including 3,872 logic elements and 484 configurable logic blocks, for compact system integration.
This device includes 63,488 bits of on-chip RAM and up to 298 user I/O pins in a 352-BBGA surface-mount package. It operates from 3.0 V to 3.6 V, is rated for commercial temperature ranges (0 °C to 70 °C), and is RoHS compliant.
Key Features
- Core and logic resources — 3,872 logic elements and 484 configurable logic blocks (CLBs) providing programmable logic capacity; specified at approximately 116,000 gates.
- Embedded memory — 63,488 bits of on-chip RAM (approximately 63 kbits) for buffering, small data storage and state retention without external memory.
- I/O density — 298 user I/O pins to accommodate multiple external interfaces on a single device.
- Package & mounting — 352-BBGA package (supplier package: 352-PBGA, 35×35) in a surface-mount form factor for compact board-level deployment.
- Power — Single-supply operation from 3.0 V to 3.6 V to align with common system power rails.
- Operating conditions & compliance — Commercial grade device rated for 0 °C to 70 °C and RoHS compliant.
Unique Advantages
- Balanced logic density: 3,872 logic elements with approximately 116k gates supports moderate-complexity programmable designs without excessive board area.
- On-chip RAM reduces BOM: About 63 kbits of embedded RAM can minimize or eliminate the need for small external memory in many control and buffering tasks.
- High pin count in a compact footprint: 298 I/O pins in a 352-BBGA package consolidates connectivity while maintaining a compact board footprint.
- Surface-mount integration: 352-BBGA surface-mount packaging simplifies placement and routing for automated assembly.
- Commercial temperature and RoHS compliance: Rated 0 °C to 70 °C and compliant with RoHS requirements for mainstream commercial products.
- Single-supply compatibility: 3.0–3.6 V operation aligns with common system rails to simplify power design.
Why Choose OR3T806BA352-DB?
The OR3T806BA352-DB delivers a practical combination of programmable logic, embedded memory and high I/O count in a compact 352-BBGA surface-mount package. Its specification set — including 3,872 logic elements, ~63 kbits of on-chip RAM, 298 I/O pins, 3.0–3.6 V supply range and 0 °C to 70 °C commercial rating — makes it well suited to commercial-grade designs that require moderate logic density and strong I/O integration without external memory for small buffering tasks.
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