OR3T806PS240-DB

The OR3T806PS240-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial-grade embedded applications. It delivers a mid-density logic fabric with 3,872 logic elements, approximately 0.0635 Mbits of embedded memory, and up to 192 general-purpose I/Os in a compact 240-BFQFP exposed pad package.

This device is targeted at designs that require moderate gate density and flexible I/O in a surface-mount, commercial-temperature FPGA solution with a 3 V to 3.6 V supply range.

Key Features

• Logic Capacity  3,872 logic elements suitable for mid-density programmable logic implementations.
• Embedded Memory  Approximately 0.0635 Mbits (63,488 bits) of on-chip RAM for data buffering and small lookup tables.
• I/O and Gate Count  192 general-purpose I/Os and 116,000 equivalent gates to support complex interfacing and glue logic.
• Power  Operates from a 3 V to 3.6 V supply range to match common commercial power rails.
• Package & Mounting  240-BFQFP exposed pad package (supplier package: 240-SQFP2, 32×32) with surface-mount mounting for compact PCB layouts.
• Operating Range  Commercial temperature grade: 0 °C to 70 °C for standard commercial-environment deployments.
• Compliance  RoHS compliant to meet current environmental requirements for electronic assemblies.

Typical Applications

• Commercial Embedded Systems  Mid-density programmable logic for control, glue logic, and interface handling in commercial devices operating within 0 °C to 70 °C.
• Prototyping and Development  A compact FPGA option for validating designs that require up to 3,872 logic elements and extensive I/O in a surface-mount form factor.
• I/O Expansion and Interface Bridging  Use the 192 I/Os and 116,000-gate equivalent capacity for signal aggregation, protocol adaptation, and peripheral interfacing.

Unique Advantages

• Balanced Mid-Density Logic:  3,872 logic elements provide a practical balance of capacity and cost for many commercial FPGA tasks without overprovisioning.
• High I/O Count:  192 I/Os allow extensive external connectivity and flexible pin assignments to simplify board-level integration.
• Compact Surface-Mount Package:  240-BFQFP exposed pad package enables space-efficient PCB designs while supporting thermal conduction through the exposed pad.
• Tight Power Window:  3 V to 3.6 V supply compatibility with common commercial power architectures reduces the need for additional regulators.
• Commercial Temperature Suitability:  Rated for 0 °C to 70 °C operation to match standard commercial product deployments.
• Environmentally Compliant:  RoHS compliance supports regulatory adherence for consumer and commercial electronics manufacturing.

Why Choose OR3T806PS240-DB?

The OR3T806PS240-DB positions itself as a practical ORCA™3C FPGA option for commercial designs that require moderate logic density, substantial I/O capability, and a compact surface-mount package. With 3,872 logic elements, approximately 63,488 bits of embedded RAM, and 192 I/Os, it addresses applications that need flexible programmable logic and broad interfacing within a 3 V to 3.6 V power envelope.

Designed and supplied by Lattice Semiconductor Corporation and offered in a 240-BFQFP exposed pad package, this part is suited for engineers and procurement teams specifying a reliable, RoHS-compliant FPGA for commercial-temperature embedded projects that prioritize a compact footprint and a balanced feature set.

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