OR3T807BC432-DB

The OR3T807BC432-DB is an ORCA™3C field programmable gate array (FPGA) IC in a 432-LBGA exposed pad package. It provides mid-density programmable logic with 3 V to 3.6 V supply support and a commercial temperature grade (0 °C to 70 °C).

With 3,872 logic elements, 484 configurable logic blocks and 342 user I/O pins, this device is intended for designers who need on-chip programmable logic, embedded RAM and a high pin-count BGA package for compact PCB integration.

Key Features

• Logic Fabric  3,872 logic elements and 484 configurable logic blocks provide mid-density programmable logic resources for custom digital functions.
• Embedded Memory  Approximately 0.063 Mbits (63,488 bits) of on-chip RAM to support FIFOs, buffers and small data storage functions within the FPGA fabric.
• I/O Capacity  342 general-purpose I/O pins enable extensive external interfacing and parallel connectivity options.
• Gate Count  116,000 gates for implementing a wide range of combinational and sequential logic designs.
• Power  Single-supply operation from 3 V to 3.6 V simplifies power-rail planning for 3.3 V-based systems.
• Package & Mounting  432-LBGA exposed pad (supplier device package: 432-EBGA, 40×40) in a surface-mount form factor for high-density PCB layouts and thermal grounding via the exposed pad.
• Operating Conditions  Commercial temperature range of 0 °C to 70 °C and RoHS-compliant construction for standard industry deployments.

Typical Applications

• Embedded Systems  Use as on-board programmable logic to implement glue logic, state machines and custom accelerators within embedded products.
• Consumer Electronics  Integrate into consumer devices that require flexible I/O routing and mid-level logic integration in a compact BGA package.
• Communications & Networking  Provide protocol bridging, interface adaptation and custom packet processing using available logic and I/O resources.
• Evaluation & Prototyping  Suitable for development platforms and prototyping where a reprogrammable mid-density FPGA is required for iterative design.

Unique Advantages

• Balanced Logic Density:  3,872 logic elements and 116,000 gates deliver a mid-range resource set that fits many custom logic needs without overprovisioning.
• High I/O Count:  342 I/O pins support broad external connectivity, reducing the need for additional interface components.
• Compact BGA Package:  432-LBGA exposed pad (40×40 EBGA) offers high pin density in a small footprint while enabling thermal management through the exposed pad.
• Single-Supply Compatibility:  3 V to 3.6 V operation aligns with common 3.3 V system rails to simplify power distribution.
• On-Chip RAM:  Approximately 0.063 Mbits of embedded memory supports local buffering and data storage close to the logic fabric.
• RoHS Compliant:  Meets lead-free and restricted-substance requirements for compliant manufacturing and sourcing.

Why Choose OR3T807BC432-DB?

The OR3T807BC432-DB positions itself as a mid-density, commercially graded FPGA option delivering a balanced mix of logic elements, embedded memory and a high I/O count in a compact 432-LBGA exposed pad package. Its electrical and thermal characteristics support integration into 3.3 V-based designs that require on-board programmability and flexible interface options.

This device is well suited to designers and teams building embedded platforms, consumer products or communication interfaces that need a reprogrammable logic element with a modest on-chip RAM footprint and a large number of external I/Os. RoHS compliance and surface-mount BGA packaging help streamline assembly and regulatory considerations.

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