OR3TP126BAN256-DB

The OR3TP126BAN256-DB is an ORCA™ OR3TP12 field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-range combination of logic capacity, on-chip memory and I/O count in a compact 256-ball BGA package for commercial electronic designs.

Designed for commercial-temperature applications, this FPGA targets embedded systems and hardware designs that require moderate logic resources, generous I/O, and on-chip RAM while maintaining RoHS compliance.

Key Features

• Core Logic  Approximately 2,016 logic elements and 60,000 gates for implementing custom logic, glue logic and control functions.
• Embedded Memory  32,768 total RAM bits (approximately 32 Kbits) of on-chip memory for buffering, small FIFOs or configuration storage.
• I/O Capacity  187 I/O pins to support multiple peripherals, buses and external interfaces.
• Package & Mounting  256-ball PBGA (27 × 27) package in a surface-mount form factor for dense PCB layouts and automated assembly.
• Power  Operates from a 3 V to 3.6 V supply range compatible with common 3.3 V system rails.
• Operating Range  Commercial temperature range rated from 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded Systems  Implement control logic, protocol conversion and peripheral interfaces using the FPGA's 2,016 logic elements and 187 I/Os.
• Consumer Electronics  Integrate user interface control, signal conditioning and I/O expansion in commercial devices operating within 0 °C to 70 °C.
• Communications Equipment  Support custom framing, buffering and I/O management with on-chip RAM and a substantial I/O count.
• Prototyping & Evaluation  Use the ORCA OR3TP12 device for proof-of-concept designs and functional prototypes requiring moderate logic and memory resources.

Unique Advantages

• Balanced logic and memory resources: 2,016 logic elements paired with 32,768 bits of on-chip RAM provide a practical mix for many mid-range FPGA tasks without external memory for small buffers.
• High I/O density: 187 available I/Os enable connectivity to multiple peripherals and external devices from a single package.
• Compact BGA package: 256-PBGA (27 × 27) offers a high-density footprint suitable for space-constrained PCBs and automated surface-mount assembly.
• 3.0–3.6 V supply compatibility: Fits into common 3.3 V system power domains for straightforward integration.
• Commercial temperature rating: Specified for 0 °C to 70 °C operation for typical commercial product deployments.
• RoHS compliant: Meets environmental lead-free requirements for commercial product manufacturing.

Why Choose OR3TP126BAN256-DB?

The OR3TP126BAN256-DB provides a practical balance of logic capacity, on-chip memory and I/O in a compact 256-ball BGA package, positioned for commercial embedded and consumer-grade designs. Its specification set—2,016 logic elements, 32,768 bits of RAM, 187 I/Os, and a 3.0–3.6 V supply range—makes it suitable for applications that need moderate FPGA resources and a dense I/O footprint.

For designers and procurement teams building cost-conscious commercial products or prototypes, this ORCA OR3TP12 device offers a well-defined, RoHS-compliant option that integrates easily into 3.3 V system environments and surface-mount manufacturing processes.

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