OR4E02-2BA352C

The OR4E02-2BA352C is an ORCA™4 Field Programmable Gate Array from Lattice Semiconductor. It provides 4992 logic elements and approximately 75.8 Kbits of on-chip RAM in a compact BGA package for commercial-grade applications.

Key device attributes include 262 general-purpose I/O, a gate-equivalent size of 397,000 gates, surface-mount 352-BBGA packaging (supplier device package: 352-PBGA, 35×35 mm), RoHS compliance, a supply voltage range of 1.425 V to 1.575 V, and an operating temperature range of 0 °C to 70 °C.

Key Features

• Core Logic 4992 logic elements provide the programmable fabric needed to implement custom digital functions and moderate-complexity designs.
• Embedded Memory Approximately 75.8 Kbits of total on-chip RAM for local buffering, small FIFOs, and lookup tables.
• I/O Capacity 262 general-purpose I/O pins to support multiple external interfaces and peripheral connections.
• Gate Equivalence Device contains 397,000 gates, offering a quick reference for overall logic capacity in gate-equivalent terms.
• Power Narrow core supply range of 1.425 V to 1.575 V for predictable power planning.
• Package & Mounting 352-BBGA package (supplier: 352-PBGA, 35×35 mm) in a surface-mount form factor for high I/O density on PCB layouts.
• Operating Conditions Commercial-grade device rated for 0 °C to 70 °C operation.
• Regulatory Compliance RoHS compliant.

Typical Applications

• I/O-intensive interfaces Leverage 262 I/O pins to connect multiple external peripherals, buses, or parallel interfaces without extensive external glue logic.
• Compact embedded logic Use 4992 logic elements to integrate control logic, protocol handling, and glue functions into a single FPGA for space- and cost-efficient designs.
• Local buffering and temporary storage Approximately 75.8 Kbits of on-chip RAM support small FIFOs, lookup tables, and transient data storage close to the logic fabric.

Unique Advantages

• Balanced logic and memory The combination of nearly 5k logic elements and on-chip RAM reduces reliance on external memory for many embedded tasks.
• High I/O density 262 I/O pins simplify board-level connectivity and can minimize additional I/O expansion hardware.
• Compact BGA footprint 352-BBGA / 352-PBGA (35×35 mm) packaging enables dense PCB layouts while supporting a large number of signals.
• Commercial temperature rating Designed for 0 °C to 70 °C operation, aligning with standard commercial product requirements.
• RoHS compliant Meets regulatory requirements for lead-free manufacturing processes.

Why Choose OR4E02-2BA352C?

The OR4E02-2BA352C delivers a practical balance of programmable logic, embedded memory, and high I/O count in a compact BGA package for commercial-grade systems. Its specifications make it well suited for engineers who need to consolidate glue logic, protocol handling, and modest buffering into a single, surface-mount FPGA.

As a member of the ORCA™4 family from Lattice Semiconductor, this device is appropriate for designers targeting moderate-complexity digital integration where predictable power planning, on-chip resources, and high I/O density are priorities.

Request a quote or submit an inquiry to check pricing and availability for the OR4E02-2BA352C.