OR4E02-2BM416C

The OR4E02-2BM416C is an ORCA™4 field programmable gate array (FPGA) IC in a 416-BBGA package. It integrates a mix of logic resources, on-chip memory and a large number of general-purpose I/O to support mid-range programmable logic functions for commercial electronic systems.

Designed for surface-mount applications, this device targets use cases that require moderate logic density, multiple I/O signals, and a compact 35×35 mm package footprint while operating within a 1.425 V to 1.575 V supply range and a 0°C to 70°C commercial temperature window.

Key Features

• Logic Resources — 4,992 logic elements and 624 logic blocks provide the programmable fabric needed for glue logic, protocol bridging, and mid-range digital functions.
• On-chip Memory — 75,776 bits of embedded RAM for small FIFOs, registers, and buffering within user designs.
• I/O Capacity — 290 I/O pins to support multi-channel interfaces, parallel buses, and mixed-signal control signals.
• Gate Equivalent — Approximately 397,000 gates available for implementing custom logic and state machines.
• Package and Mounting — 416-BBGA surface-mount package (supplier device package 416-PBGAM, 35×35 mm) for a compact board footprint.
• Power and Temperature — Operates from 1.425 V to 1.575 V supply and within a commercial temperature range of 0°C to 70°C.
• Compliance — RoHS compliant for regulatory compatibility in commercial products.

Typical Applications

• Consumer Electronics — Implement user interface control, display drivers, and custom peripheral logic using the device’s moderate logic density and abundant I/O.
• Industrial Automation — Handle protocol bridging and sensor interfacing where commercial temperature range and on-chip RAM meet system buffering needs.
• Communications — Support packet handling, framing, and glue logic between subsystems with available logic elements and I/O channels.
• Prototyping and Development — Use as a platform for validating custom logic, state machines, and interface converters during product development.

Unique Advantages

• Balanced Logic and Memory Mix — 4,992 logic elements combined with 75,776 bits of RAM enable compact implementation of control, buffering, and state logic without external memory for many designs.
• High I/O Count — 290 I/O pins reduce the need for external I/O expanders and simplify board-level interfacing to peripherals and sensors.
• Compact Ball Grid Array — 416-BBGA (35×35 mm) package offers dense routing and a small PCB footprint for space-constrained boards.
• Commercial-Grade Operation — Specified for 0°C to 70°C operation to match mainstream commercial product requirements.
• RoHS Compliant — Meets lead-free and restricted substance requirements for commercial manufacturing.

Why Choose OR4E02-2BM416C?

The OR4E02-2BM416C positions itself as a compact, mid-density FPGA option suitable for commercial applications that need a balance of programmable logic, embedded memory, and extensive I/O in a surface-mount BBGA package. Its specified voltage range and gate capacity make it appropriate for designs that require a flexible, integrated programmable device without moving to larger FPGA families.

This device is well suited to engineers and product teams building consumer and industrial equipment, communication peripherals, or prototype platforms where board space, I/O count, and on-chip resources drive component selection. The combination of logic elements, embedded RAM, and a 416-BBGA package supports scalable designs and streamlined BOMs.

Request a quote or submit an inquiry for the OR4E02-2BM416C to receive pricing, availability, and ordering information tailored to your project needs.