OR4E02-3BA352C

The OR4E02-3BA352C is an ORCA™4 Field Programmable Gate Array (FPGA) IC designed for commercial embedded applications. It delivers a mid-range logic capacity with integrated on-chip RAM and a high available I/O count, providing a balance of integration and flexibility for compact designs.

With 4,992 logic elements, 262 I/Os and approximately 0.076 Mbits of embedded memory, this device is appropriate for commercial systems that require configurable logic, moderate on-chip storage, and a dense I/O footprint while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — 4,992 logic elements and 397,000 gates provide mid-range programmable logic resources for control, glue-logic, and moderate-compute functions.
• Embedded Memory — Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Resources — 262 I/O pins to support multiple peripheral connections, interfaces, and board-level signaling requirements.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match targeted system power rails.
• Package & Mounting — 352-BBGA package; supplier device package listed as 352-PBGA (35×35). Surface-mount mounting type for compact PCB integration.
• Operating Conditions — Commercial grade device specified for 0 °C to 70 °C operation.
• Environmental Compliance — RoHS compliant to support environmental material requirements.

Typical Applications

• Embedded Control and Logic Integration — Use the 4,992 logic elements to implement custom control logic, protocol handling, and glue logic in commercial embedded products.
• I/O Expansion and Interface Bridging — 262 I/Os allow consolidation of multiple peripheral interfaces and board-level signal routing in space-constrained designs.
• Prototyping and Proof-of-Concept — Sized for mid-range designs where configurable logic, on-chip RAM and a dense I/O count support iterative development and functional validation.

Unique Advantages

• Right-sized Logic Density: 4,992 logic elements and 397,000 gates offer a balance between capacity and cost for mid-range FPGA tasks.
• Integrated On-chip RAM: Approximately 0.076 Mbits of embedded memory reduces dependency on external RAM for small buffers and lookup tables.
• High I/O Count: 262 I/Os provide flexibility to connect multiple peripherals and interfaces without additional bridge components.
• Compact Surface-Mount Package: 352-BBGA / 352-PBGA (35×35) packaging supports compact PCB layouts and dense system integration.
• Commercial Temperature and Supply Compatibility: Operates at 0 °C to 70 °C with a 1.425 V–1.575 V core supply to match common commercial system environments.
• RoHS Compliance: Material compliance simplifies meeting environmental and regulatory requirements.

Why Choose OR4E02-3BA352C?

The OR4E02-3BA352C positions itself as a compact, mid-range FPGA solution for commercial embedded designs that require flexible logic, a substantial I/O count, and on-chip memory in a space-efficient package. Its combination of 4,992 logic elements, 262 I/Os, and a 352-BBGA surface-mount package supports integration in constrained board layouts while maintaining configurable system capability.

This device is suited to developers and product teams seeking a commercially graded, RoHS-compliant FPGA with predictable operating conditions (0 °C to 70 °C) and a defined voltage supply range (1.425 V to 1.575 V), offering scalability and predictable integration for medium-complexity FPGA designs.

Request a quote or submit a quote to receive pricing and availability information for the OR4E02-3BA352C. Our team can provide the next steps to procure this FPGA for your project needs.