OR4E04-2BM416C

The OR4E04-2BM416C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation featuring the ORCA™4 architecture. It delivers a balance of logic density, I/O capacity and embedded memory in a compact 416-BBGA package for commercial-grade applications.

Key attributes include 10,368 logic elements, 290 I/Os, approximately 0.114 Mbits of on-chip RAM and a 643,000-gate implementation, designed for surface-mount assembly and operation across a commercial temperature range.

Key Features

• Core Logic  10,368 logic elements with an overall design gate count of 643,000 to support moderate-density programmable logic implementations.
• Embedded Memory  Approximately 0.114 Mbits (113,664 bits) of total on-chip RAM for buffering, state storage and small data arrays within the FPGA fabric.
• I/O Density  290 general-purpose I/Os to support a wide variety of peripheral connections and signal interfacing in a single device.
• Package & Assembly  416-BBGA in supplier device package 416-PBGAM (35x35) for high-pin-count, surface-mount integration.
• Power  Specified core supply range of 1.425 V to 1.575 V to match system power rails and regulators within the stated range.
• Temperature & Grade  Commercial-grade operation from 0°C to 70°C, suitable for standard commercial embedded environments.
• Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Commercial Embedded Systems  Use the FPGA for custom logic, peripheral aggregation and control functions within commercial electronic products operating in the 0°C–70°C range.
• High-Density I/O Bridging  Leverage 290 I/Os to interface multiple sensors, displays or communication peripherals in systems that require many signals routed through programmable logic.
• Custom Interface and Glue Logic  Implement protocol converters, timing adaptation and intermediary logic between discrete components using the device’s logic elements and on-chip RAM.
• Prototyping and Evaluation  Evaluate custom logic designs and iterate hardware prototypes that require a mid-range logic capacity and substantial I/O.

Unique Advantages

• Balanced Logic and Memory Mix: 10,368 logic elements paired with approximately 0.114 Mbits of embedded RAM enable implementations that need both combinational/sequential logic and local storage.
• High I/O Count: 290 I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-peripheral designs.
• Compact, High-Pin Package: The 416-BBGA (416-PBGAM, 35x35) package delivers dense pinout in a surface-mount form factor suitable for PCB space-constrained designs.
• Defined Power Envelope: A narrow core voltage range (1.425 V–1.575 V) simplifies power supply selection and regulation for consistent device operation.
• Commercial Temperature Compliance: Rated for 0°C–70°C operation and RoHS compliance to meet standard commercial product requirements.

Why Choose OR4E04-2BM416C?

The OR4E04-2BM416C positions itself as a practical, commercial-grade FPGA choice where moderate logic capacity, substantial I/O and on-chip memory are required in a single, surface-mount package. Its combination of 10,368 logic elements, 290 I/Os and approximately 0.114 Mbits of embedded RAM delivers the integration needed to reduce external components and simplify board-level design.

This device is well suited for designers building commercial embedded systems, interface bridges, and prototype platforms that require a clearly specified power and temperature envelope along with RoHS compliance.

Request a quote or submit your procurement inquiry to obtain pricing and lead-time information for the OR4E04-2BM416C FPGA for your next design.