OR4E04-3BM680C

The OR4E04-3BM680C is a field programmable gate array (FPGA) from the ORCA™4 family, delivering a balanced combination of logic capacity, embedded memory, and high I/O count in a 680-ball BGA package. It is intended for programmable logic applications that require substantial gate density, on-chip RAM, and extensive external interfacing within commercial temperature limits.

Key attributes include 10,368 logic elements, approximately 113,664 bits of embedded memory, 466 I/O pins, and a 680-BBGA (680-PBGAM, 35×35) surface-mount package optimized for compact, high-density board designs.

Key Features

• Core Logic  10,368 logic elements provide capacity for moderate to complex programmable logic implementations and custom digital functions.
• Embedded Memory  Approximately 113,664 bits of on-chip RAM support data buffering, small lookup tables, and localized storage without external memory.
• I/O Density  466 user I/O pins enable broad peripheral interfacing and multiple parallel signal connections for flexible system integration.
• Gate Count  643,000 gates for mapping a wide range of digital designs and logic structures.
• Power  Low-voltage core supply range of 1.425 V to 1.575 V to match contemporary low-voltage system designs.
• Package & Mounting  680-ball BGA (680-PBGAM, 35×35) in a surface-mount form factor for high-density PCB layouts.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 70 °C operation.
• Environmental Compliance  RoHS compliant for compliance with common environmental standards.

Typical Applications

• High-density I/O systems  Use the 466 I/O pins to interface multiple peripherals, sensors, or parallel data streams in applications requiring extensive connectivity.
• Embedded logic and control  Implement custom control logic and state machines using the device's 10,368 logic elements and on-chip RAM for localized data handling.
• Signal routing and glue logic  Serve as a programmable glue layer to aggregate and route signals between subsystems while minimizing external components.
• Prototyping and development  Leverage the device’s moderate gate count and memory to validate and iterate digital designs before scaling into production.

Unique Advantages

• High logic capacity: 10,368 logic elements enable integration of sizable custom logic functions within a single device, reducing PCB complexity.
• Integrated on-chip memory: Approximately 113,664 bits of embedded RAM provide local storage for buffering and small-data processing without added external memory.
• Extensive I/O connectivity: 466 I/O pins support broad interfacing needs, allowing consolidation of multiple signals and peripherals on one FPGA.
• Compact, high-density package: 680-BBGA (680-PBGAM, 35×35) surface-mount package supports dense PCB layouts while maintaining routing flexibility.
• Low-voltage core operation: Operates from 1.425 V to 1.575 V to align with low-voltage system architectures and power management strategies.
• Regulatory readiness: RoHS compliance supports environmentally constrained design and procurement requirements.

Why Choose OR4E04-3BM680C?

The OR4E04-3BM680C positions itself as a versatile commercial-grade FPGA for designers who need a substantial mix of logic, embedded memory, and I/O capacity in a compact BGA package. Its combination of 10,368 logic elements, approximately 113,664 bits of on-chip RAM, and 466 I/O pins makes it suitable for systems that require integrated programmable logic without extensive external components.

Choose this ORCA™4 FPGA when your design priorities include moderate-to-high logic density, significant local memory, and high connectivity within a surface-mount 680-ball BGA footprint, all within standard commercial temperature and voltage ranges.

Request a quote or submit an inquiry to obtain pricing and availability for OR4E04-3BM680C. Our team can provide details to support procurement and design planning.