OR4E06-1BM680C

The OR4E06-1BM680C is an ORCA™4 Field Programmable Gate Array (FPGA) offered in a 680-ball BBGA package. It provides a fabric with 16,192 logic elements, approximately 0.15 Mbits of embedded RAM, and 466 user I/O pins, making it suitable for designs requiring substantial on-chip logic and connectivity in a compact surface-mount package.

Designed for commercial-grade applications, this device operates from a core supply of 1.425 V to 1.575 V and across a 0 °C to 70 °C temperature range. The 680-PBGAM (35×35) package delivers high pin density while supporting standard surface-mount assembly processes.

Key Features

• FPGA Core: 16,192 logic elements provide the programmable fabric for implementing custom logic, state machines, and glue logic.
• On-Chip Memory: Approximately 0.15 Mbits (151,552 bits) of embedded RAM to support buffering, FIFOs, and small data tables within the device.
• I/O Capacity: 466 user I/O pins to support multiple parallel interfaces, buses, and peripheral connections.
• Gate Equivalent: 899,000 gates of logic capacity for medium-density integration requirements.
• Package & Mounting: 680-BBGA in a 680-PBGAM (35×35) form factor with surface-mount mounting type for high pin-count, space-efficient board layouts.
• Power: Core voltage supply range 1.425 V to 1.575 V to match system power rails and regulator selections.
• Temperature & Grade: Commercial grade operation from 0 °C to 70 °C for standard commercial electronics applications.
• Regulatory Compliance: RoHS-compliant construction for environmental and manufacturing compatibility.

Typical Applications

• Communications Equipment: Implement interface bridging, protocol handling, and custom packet processing using abundant logic and I/O resources.
• Consumer Electronics: Custom control, signaling, and peripheral aggregation where on-chip memory and high I/O counts simplify board-level design.
• Prototyping and Development: Evaluate and validate mid-density FPGA designs and system integration in laboratory or desktop environments.
• Test and Measurement: Onboard data capture, real-time control, and interface consolidation benefiting from embedded RAM and numerous I/O.

Unique Advantages

• High Logic Capacity: 16,192 logic elements enable substantial custom logic implementation without immediate need for external ASICs or CPLDs.
• Generous I/O Count: 466 I/O pins facilitate multiple parallel interfaces and flexible board-level partitioning.
• On-Chip Memory: Approximately 0.15 Mbits of embedded RAM supports local buffering and small data structures, reducing external memory dependencies.
• Compact High-Pin Package: 680-BBGA (680-PBGAM, 35×35) delivers high pin density for complex systems in a compact footprint.
• Commercial Temperature Suitability: Rated for 0 °C to 70 °C operation to match common commercial electronics deployment scenarios.
• RoHS Compliance: Environmental compliance eases integration into modern manufacturing and supply chains.

Why Choose OR4E06-1BM680C?

The OR4E06-1BM680C balances mid-to-high logic capacity with a large I/O complement and embedded RAM, packaged in a high-density 680-BBGA footprint. Its supply voltage range and commercial temperature rating make it appropriate for a wide range of commercial electronics projects where on-chip resources and pin density reduce board-level complexity.

This FPGA suits design teams and procurement groups looking for a programmable, high-pin-count device for communications, consumer, test, and development applications, offering a combination of integration, I/O flexibility, and RoHS-compliant manufacturing compatibility.

Request a quote or submit a purchase inquiry to begin evaluation and receive pricing and availability information for the OR4E06-1BM680C.