OR4E06-1BA352C
| Part Description |
ORCA™4 Field Programmable Gate Array (FPGA) IC 262 151552 16192 352-BBGA |
|---|---|
| Quantity | 1,383 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-PBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BBGA | Number of I/O | 262 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2024 | Number of Logic Elements/Cells | 16192 | ||
| Number of Gates | 899000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 151552 |
Overview of OR4E06-1BA352C – ORCA™4 Field Programmable Gate Array (FPGA) IC 262 151552 16192 352-BBGA
The OR4E06-1BA352C is an ORCA™4 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a mid-range programmable logic resource set suitable for designs that require configurable hardware, moderate embedded memory, and a high I/O count.
Designed for commercial-temperature applications, this device targets use where flexibility and board-level integration are priorities, offering a compact 352-BBGA package and low-voltage core operation.
Key Features
- Logic Capacity 16192 logic elements and 2024 CLBs provide a balanced fabric for implementing custom logic, state machines, and glue logic.
- Embedded Memory Approximately 0.15 Mbits (151,552 bits) of on-chip RAM for FIFOs, buffers, and small data stores.
- I/O Density 262 user I/O pins to support multiple parallel interfaces and board-level connectivity.
- Gate Count 899,000 gates indicating the overall transistor-scale integration available in this device.
- Power Core voltage supply range of 1.425 V to 1.575 V for low-voltage system designs.
- Package 352-BBGA (supplier package: 352-PBGA 35×35) providing a compact ball-grid footprint for space-constrained PCBs.
- Mounting & Grade Surface mount device, commercial grade with an operating temperature range of 0 °C to 70 °C.
- Environmental Compliance RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- Embedded Systems Implement custom control logic, protocol handling, and glue functions where reprogrammability is required.
- Interface Bridging High I/O count enables bridging between multiple peripherals and buses on a single device.
- Consumer Electronics Flexible logic and compact package make it suitable for consumer devices operating within commercial temperature ranges.
Unique Advantages
- Balanced Logic and Memory: 16k+ logic elements combined with on-chip RAM support diverse functions from control logic to small buffering without external memory.
- High I/O Capacity: 262 I/O pins reduce the need for external multiplexing and simplify board-level interconnect.
- Compact Packaging: 352-BBGA package offers a small footprint for space-constrained designs while maintaining a large pin count.
- Low-Voltage Core Operation: 1.425 V to 1.575 V supply range suits modern low-voltage system architectures.
- Commercial Temperature Range: Rated for 0 °C to 70 °C, appropriate for a wide range of non-industrial applications.
- Regulatory Compliance: RoHS compliance supports modern manufacturing and sourcing requirements.
Why Choose OR4E06-1BA352C?
The OR4E06-1BA352C positions itself as a versatile, mid-range FPGA for designers who need a combination of modest logic capacity, significant I/O, and embedded memory in a compact BGA package. Its commercial-grade rating and RoHS compliance make it suitable for mainstream electronic products and development platforms.
This device is well suited for teams building embedded controllers, interface bridges, and consumer-focused hardware that benefit from on-board programmability, compact packaging, and a well-defined power and temperature envelope backed by Lattice Semiconductor Corporation.
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