OR4E06-2BA352C

FPGA, 2024 CLBS, 471000 GATES
Part Description

ORCA™4 Field Programmable Gate Array (FPGA) IC 262 151552 16192 352-BBGA

Quantity 180 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package352-PBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case352-BBGANumber of I/O262Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2024Number of Logic Elements/Cells16192
Number of Gates899000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits151552

Overview of OR4E06-2BA352C – ORCA™4 Field Programmable Gate Array (FPGA) IC 262 151552 16192 352-BBGA

The OR4E06-2BA352C is an ORCA™4 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a programmable logic fabric with 16,192 logic elements, approximately 0.15 Mbits of embedded RAM, and 262 user I/Os in a compact 352-BBGA package.

Designed for commercial-grade applications, this device combines a high gate count (899,000 gates), a low-voltage supply range (1.425 V to 1.575 V), and RoHS compliance to support modern embedded designs requiring programmable logic, on-chip memory, and substantial I/O capacity.

Key Features

  • Logic Capacity — 16,192 logic elements providing the programmable resources needed for complex logic implementations.
  • On-Chip Memory — Approximately 0.15 Mbits of embedded RAM (151,552 bits) for data buffering, state storage, and small memory blocks.
  • I/O Resources — 262 user I/Os to support wide external interfacing and parallel connectivity.
  • Gate Count — 899,000 gates offering extensive logic density for medium-scale FPGA designs.
  • Power — Supports a core supply voltage range of 1.425 V to 1.575 V for integration with low-voltage systems.
  • Package — 352-BBGA package (supplier device package: 352-PBGA (35x35)) in a surface-mount form factor suitable for compact board layouts.
  • Operating Conditions — Commercial operating temperature range of 0 °C to 70 °C and commercial device grade.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Commercial Embedded Systems — Programmable logic and on-chip RAM provide flexible implementation of control logic, state machines, and custom interfaces for commercial products.
  • I/O-Intensive Control — The 262 I/Os enable designs that require broad external connectivity, parallel sensor interfaces, or multi-channel I/O aggregation.
  • Prototyping and Development — Logic capacity and programmable resources make the device suitable for evaluating and iterating digital designs in commercial development environments.

Unique Advantages

  • Substantial Logic Density: 16,192 logic elements and 899,000 gates provide the resources to implement complex combinational and sequential logic without external ASICs.
  • Integrated Memory: Approximately 0.15 Mbits of on-chip RAM reduces external memory dependence for small buffering and state storage.
  • High I/O Count: 262 user I/Os simplify designs that require extensive peripheral and external device connections.
  • Compact PBGA Package: 352-BBGA / 352-PBGA (35x35) enables a high-density footprint for space-constrained PCBs while maintaining surface-mount compatibility.
  • Low-Voltage Core: Narrow supply range (1.425 V to 1.575 V) aligns with modern low-voltage system domains.
  • Commercial Qualification and RoHS Compliance: Commercial grade operation (0 °C to 70 °C) and RoHS compliance support standard commercial product requirements.

Why Choose OR4E06-2BA352C?

The OR4E06-2BA352C positions itself as a commercial-grade FPGA offering balanced logic capacity, on-chip memory, and extensive I/O in a compact 352-BBGA package. Its combination of 16,192 logic elements, approximately 0.15 Mbits of embedded RAM, and 262 I/Os makes it well suited for commercial embedded designs that require programmable logic integration and significant external connectivity.

Manufactured by Lattice Semiconductor Corporation and provided in a surface-mount, RoHS-compliant package, this device is aimed at engineers and product teams looking for a programmable, mid-density FPGA solution for commercial applications where board space, I/O count, and on-chip resources are key considerations.

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