OR4E06-2BA352C
| Part Description |
ORCA™4 Field Programmable Gate Array (FPGA) IC 262 151552 16192 352-BBGA |
|---|---|
| Quantity | 180 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-PBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BBGA | Number of I/O | 262 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2024 | Number of Logic Elements/Cells | 16192 | ||
| Number of Gates | 899000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 151552 |
Overview of OR4E06-2BA352C – ORCA™4 Field Programmable Gate Array (FPGA) IC 262 151552 16192 352-BBGA
The OR4E06-2BA352C is an ORCA™4 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a programmable logic fabric with 16,192 logic elements, approximately 0.15 Mbits of embedded RAM, and 262 user I/Os in a compact 352-BBGA package.
Designed for commercial-grade applications, this device combines a high gate count (899,000 gates), a low-voltage supply range (1.425 V to 1.575 V), and RoHS compliance to support modern embedded designs requiring programmable logic, on-chip memory, and substantial I/O capacity.
Key Features
- Logic Capacity — 16,192 logic elements providing the programmable resources needed for complex logic implementations.
- On-Chip Memory — Approximately 0.15 Mbits of embedded RAM (151,552 bits) for data buffering, state storage, and small memory blocks.
- I/O Resources — 262 user I/Os to support wide external interfacing and parallel connectivity.
- Gate Count — 899,000 gates offering extensive logic density for medium-scale FPGA designs.
- Power — Supports a core supply voltage range of 1.425 V to 1.575 V for integration with low-voltage systems.
- Package — 352-BBGA package (supplier device package: 352-PBGA (35x35)) in a surface-mount form factor suitable for compact board layouts.
- Operating Conditions — Commercial operating temperature range of 0 °C to 70 °C and commercial device grade.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Commercial Embedded Systems — Programmable logic and on-chip RAM provide flexible implementation of control logic, state machines, and custom interfaces for commercial products.
- I/O-Intensive Control — The 262 I/Os enable designs that require broad external connectivity, parallel sensor interfaces, or multi-channel I/O aggregation.
- Prototyping and Development — Logic capacity and programmable resources make the device suitable for evaluating and iterating digital designs in commercial development environments.
Unique Advantages
- Substantial Logic Density: 16,192 logic elements and 899,000 gates provide the resources to implement complex combinational and sequential logic without external ASICs.
- Integrated Memory: Approximately 0.15 Mbits of on-chip RAM reduces external memory dependence for small buffering and state storage.
- High I/O Count: 262 user I/Os simplify designs that require extensive peripheral and external device connections.
- Compact PBGA Package: 352-BBGA / 352-PBGA (35x35) enables a high-density footprint for space-constrained PCBs while maintaining surface-mount compatibility.
- Low-Voltage Core: Narrow supply range (1.425 V to 1.575 V) aligns with modern low-voltage system domains.
- Commercial Qualification and RoHS Compliance: Commercial grade operation (0 °C to 70 °C) and RoHS compliance support standard commercial product requirements.
Why Choose OR4E06-2BA352C?
The OR4E06-2BA352C positions itself as a commercial-grade FPGA offering balanced logic capacity, on-chip memory, and extensive I/O in a compact 352-BBGA package. Its combination of 16,192 logic elements, approximately 0.15 Mbits of embedded RAM, and 262 I/Os makes it well suited for commercial embedded designs that require programmable logic integration and significant external connectivity.
Manufactured by Lattice Semiconductor Corporation and provided in a surface-mount, RoHS-compliant package, this device is aimed at engineers and product teams looking for a programmable, mid-density FPGA solution for commercial applications where board space, I/O count, and on-chip resources are key considerations.
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