ORLI10G-3BM680C

The ORLI10G-3BM680C is a commercial-grade ORCA® ORLI10G field programmable gate array (FPGA) IC. It integrates 10,368 logic elements, approximately 0.114 Mbits of embedded memory, and 316 general-purpose I/O pins in a 680-BBGA package.

Designed for programmable-logic applications that require a balance of logic density, I/O capacity, and on-chip memory, this device supports operation across a 3 V to 3.6 V supply range and an operating temperature from −40 °C to 125 °C.

Key Features

• Logic Capacity  10,368 logic elements providing programmable logic resources for custom digital designs.
• Embedded Memory  Approximately 0.114 Mbits of on-chip RAM (113,664 total RAM bits) for buffering, state storage, and small data structures.
• I/O Density  316 I/O pins to support multiple interfaces and parallel connections within a single device.
• Gate Equivalent  Approximately 643,000 gates for implementing complex logic and control functions.
• Power Supply  Operates from 3 V to 3.6 V, compatible with common commercial voltage rails.
• Package and Mounting  680-BBGA (supplier device package: 680-PBGAM, 35 × 35 mm) in a surface-mount form factor for compact PCB integration.
• Thermal Range  Rated for operation from −40 °C to 125 °C to support a wide range of commercial environments.
• Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Programmable logic for control, protocol conversion, and custom I/O tasks in commercial equipment.
• I/O-Intensive Interface Bridging  High I/O count supports interface aggregation, signal bridging, and multi-channel connectivity on a single FPGA.
• On-Chip Data Handling  Built-in RAM and gate capacity enable buffering, packet handling, and moderate on-chip data processing tasks.

Unique Advantages

• Balanced Logic and Memory: Combines 10,368 logic elements with 113,664 bits of RAM to implement mid-density logic designs with on-chip storage.
• High I/O Count: 316 I/Os allow consolidation of multiple external interfaces without additional interface chips, reducing board-level complexity.
• Compact, Surface-Mount Package: 680-BBGA (35 × 35 mm) package supports high-density PCB layouts while maintaining robust connectivity.
• Wide Operating Conditions: Operational range from −40 °C to 125 °C and a 3 V–3.6 V supply range provide flexibility for varied commercial environments and power architectures.
• RoHS Compliant: Meets lead-free and hazardous substance reduction requirements for modern manufacturing processes.

Why Choose ORLI10G-3BM680C?

The ORLI10G-3BM680C offers a practical combination of logic capacity, embedded memory, and I/O density in a single commercial-grade FPGA package. Its specifications make it suitable for designers who need programmable logic with substantial I/O and moderate on-chip memory while maintaining compact board-level integration.

This device is well suited to customers developing commercial embedded systems and interface-focused designs that require reliable, RoHS-compliant FPGA hardware backed by defined electrical and thermal operating parameters.

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