ORSO42G5-1BMN484C

IC FPGA 204 I/O 484FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA

Quantity 62 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O204Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORSO42G5-1BMN484C – ORCA® 4 FPGA IC, 204 I/O, 484-BBGA

The ORSO42G5-1BMN484C is an ORCA® Series 4 reconfigurable FPGA with integrated high‑speed transceiver functionality targeted at backplane and board-level data interfaces. Built on Lattice’s Series 4 architecture, this device combines on‑chip programmable logic with four integrated 0.6–2.7 Gbps SERDES channels, making it suitable for high‑speed SONET and non‑SONET backplane designs and other interdevice communication applications.

Key value comes from a compact 484‑ball BGA package, a broad supply voltage range, and a mix of logic, embedded RAM and I/O suitable for network interface, data framing and protocol bridging functions in commercial temperature environments.

Key Features

  • Programmable Logic Capacity — 10,368 logic elements providing flexible on‑chip logic for protocol, framing and custom datapath implementations.
  • High‑Speed Serial I/O — Four integrated SERDES channels supporting 0.6 to 2.7 Gbps per channel and aggregate bandwidth in excess of 10 Gbps for high‑speed backplane links; includes clock‑and‑data recovery (CDR) functionality as described in the Series 4 family datasheet.
  • Embedded Memory — 113,664 bits of on‑chip RAM (approximately 0.11 Mbits) for FIFO, buffer and state storage requirements.
  • I/O Count — 204 user I/O pins suitable for broad interfacing needs across protocol and control planes.
  • Logic Gate Density — Up to 643,000 system gates (family range), enabling complex protocol and processing implementations.
  • Package & Mounting — 484‑BBGA (supplier package: 484‑FPBGA, 23 × 23 mm) in a surface‑mount form factor for compact board integration.
  • Power & Voltage — Flexible supply range from 1.425 V to 3.6 V to accommodate multiple I/O and core domain requirements.
  • Operating Range & Grade — Commercial grade device rated for 0 °C to 70 °C operating temperature.
  • Compliance — RoHS compliant.

Typical Applications

  • SONET/SDH Backplane Interfaces — Implements SONET framing, scrambling/descrambling and TOH‑related functions using integrated SERDES and programmable logic for line card termination and backplane transport.
  • High‑Speed Backplane Links — Provides clock‑recovered serial channels and FPGA logic to create 10 Gbps class backplane connections and protocol bridging between boards.
  • Interdevice Communication — Enables clockless, recovered‑clock links across boards or within systems to reduce backplane signal count and simplify clock domains.
  • Custom Network Termination — Use embedded logic and memory to build protocol access logic, framers and proprietary cell processing for network termination and data format conversion.

Unique Advantages

  • Integrated Transceivers plus FPGA: Combines four high‑speed SERDES channels and CDR with programmable logic to minimize external components and simplify high‑speed interface designs.
  • Compact, High‑Pin‑Count Package: 484‑BBGA in a 23 × 23 mm footprint supports large I/O counts and dense board layouts without a large package penalty.
  • Flexible Voltage Support: Wide supply range (1.425 V to 3.6 V) enables mixed‑voltage interfacing and system design flexibility.
  • Substantial Logic & Memory Resources: 10,368 logic elements and 113,664 bits of embedded RAM allow implementation of protocol stacks, buffering and custom datapaths on a single device.
  • Commercial‑Grade Reliability: Specified for 0 °C to 70 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose ORSO42G5-1BMN484C?

The ORSO42G5-1BMN484C positions itself as a compact, integrated solution for high‑speed backplane and board‑level interfaces where combined SERDES channels and FPGA logic are required. Its mix of logic elements, embedded RAM and 204 I/O pins supports implementation of framing, protocol processing and custom data handling within a single 484‑ball BGA device.

Designed for commercial applications that need robust data throughput and flexible interfacing, this ORCA® Series 4 device delivers a balance of integration, I/O density and power domain flexibility while remaining RoHS compliant for modern PCB assembly processes.

If you would like pricing, availability or a formal quote for the ORSO42G5-1BMN484C, request a quote or submit your requirements to receive a tailored response from our sales team.

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