ORSO42G5-2BM484I
| Part Description |
ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA |
|---|---|
| Quantity | 466 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet | N/A |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 204 | Voltage | 1.425 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 10368 | ||
| Number of Gates | 643000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of ORSO42G5-2BM484I – ORCA® 4 FPGA, 204 I/O, 10,368 logic elements, 484-BBGA
The ORSO42G5-2BM484I is an ORCA® Series 4 field programmable gate array (FPGA) device optimized for high-speed backplane interfaces. Built on the Series 4 reconfigurable embedded SoC architecture, the device integrates programmable logic, embedded memory, and high‑speed SERDES channels targeted at SONET/backplane and other high‑bandwidth interconnect applications.
This industrial‑grade surface‑mount device delivers 10,368 logic elements, 204 user I/O pins and built‑in SERDES and CDR functionality to support aggregated multi‑Gbps links, while operating across a wide supply range and industrial temperature window for robust deployment.
Key Features
- Series 4 SoC architecture – Reconfigurable embedded System‑on‑a‑Chip architecture for integration of FPGA logic and backplane transceiver functions.
- Programmable logic density – 10,368 logic elements (1296 PFUs) and up to 643,000 system gates for implementing complex custom logic and protocol processing.
- Embedded memory – Approximately 113,664 bits of on‑chip RAM; datasheet notes two 4K×36 (144K‑bit each) RAM blocks in the embedded core accessible by FPGA logic.
- High‑speed serial interfaces – Four integrated SERDES channels supporting 0.6 to 2.7 Gbps per channel with built‑in clock and data recovery (CDR) for backplane and SONET interfaces.
- I/O and package – 204 user I/O in a 484‑BBGA (484‑FPBGA 23×23) package, surface mount mounting for high‑density board designs.
- Power and temperature – Wide supply range from 1.425 V to 3.6 V and industrial operating temperature range of −40 °C to 85 °C.
- SONET/SDH support (family level) – Family datasheet documents SONET scrambling/descrambling, streamlined framing and limited TOH handling suitable for backplane SONET interfaces; built‑in CDR simplifies clock domain handling.
- Regulatory status – RoHS compliant.
Typical Applications
- Backplane interconnects – Implement high‑speed multi‑Gbps links and aggregation channels between line cards and switch fabrics using integrated SERDES and CDR.
- SONET/SDH networking modules – Terminate or interface SONET streams with on‑device scrambling/descrambling, framing and programmable protocol logic.
- High‑density FPGA logic – Deploy custom packet processing, framing, or proprietary cell processing across an FPGA fabric with significant gate and RAM resources.
- Multi‑board systems – Use built‑in clock recovery to simplify clock domains and reduce backplane signal count in multi‑board network systems.
Unique Advantages
- Integrated high‑speed transceivers: Four SERDES channels with CDR reduce external device count and simplify board-level clocking for backplane links.
- Substantial programmable resources: 10,368 logic elements and up to 643,000 system gates enable complex logic, protocol stacks and custom data processing on a single device.
- Compact, high‑I/O package: 484‑BBGA (23×23) package provides 204 user I/O for dense interconnects while keeping board footprint compact.
- Industrial reliability: −40 °C to 85 °C operating range and RoHS compliance support deployment in industrial network equipment.
- Flexible power envelope: Wide supply range (1.425 V to 3.6 V) accommodates varied IO standards and system power architectures.
Why Choose ORSO42G5-2BM484I?
The ORSO42G5-2BM484I positions itself as an integrated FPGA solution for designers needing programmable logic closely coupled with multi‑Gbps backplane transceivers and SONET‑oriented features. Its combination of >10k logic elements, embedded RAM, four SERDES channels with CDR, and a 204‑pin I/O count in a 484‑BBGA package makes it suited for line cards, backplane interface modules and multi‑board networking systems that require both protocol handling and custom processing.
Because it adheres to industrial temperature ranges and RoHS requirements and supports a broad supply voltage window, the device is appropriate for long‑lifecycle communications equipment designs where integration, scalability and predictable electrical/thermal characteristics are required.
Request a quote or submit an inquiry to obtain pricing, availability and technical ordering information for the ORSO42G5-2BM484I.