ORSO42G5-2BMN484I
| Part Description |
ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA |
|---|---|
| Quantity | 47 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 204 | Voltage | 1.425 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 10368 | ||
| Number of Gates | 643000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of ORSO42G5-2BMN484I – ORCA® 4 FPGA, 204 I/O, ~0.114 Mbit RAM, 10,368 logic elements, 484-BBGA
The ORSO42G5-2BMN484I is an ORCA® Series 4 field-programmable gate array (FPGA) device optimized for high-speed backplane interfaces and embedded logic integration. Built on Lattice’s Series 4 reconfigurable embedded SoC architecture, the device combines FPGA fabric, embedded memory, and integrated high-speed SERDES channels to address demanding communications and networking designs.
Targeted use cases include SONET/SDH and other high-speed backplane applications where integrated clock and data recovery, multi-gigabit serial channels, and substantial logic resources are required. The device offers a balance of logic capacity, embedded RAM, and I/O density in a compact 484-ball BGA package for industrial-grade systems.
Key Features
- FPGA Logic Capacity Provides 10,368 logic elements for implementing custom packet handling, protocol logic, and system glue logic.
- Embedded Memory Approximately 0.114 Mbits (113,664 bits) of on-chip RAM to support buffering, FIFOs, and small lookup tables within the FPGA fabric.
- High-speed Serial Interfaces Integrated SERDES channels (0.6 to 2.7 Gbps per channel) with built-in clock and data recovery—designed for high-speed backplane and interdevice communication.
- I/O Density 204 user I/O pins to support complex board-level interfaces and multiple high-speed links.
- System Gate Equivalent System gate count up to 643,000 to represent the usable logic capacity for system-level designs.
- Package and Mounting 484-ball FBGA (23 × 23 mm) surface-mount package for compact board integration and reliable solder connection.
- Voltage and Power Flexible supply range from 1.425 V to 3.6 V to fit a variety of board power architectures.
- Industrial Temperature Grade Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
- Standards and Compliance RoHS-compliant manufacturing to meet environmental and regulatory requirements.
Typical Applications
- SONET/SDH Backplane Interfaces Implement STS/STM framing, scrambling/descrambling, and Transport Overhead handling with integrated SERDES and CDR functions.
- High‑speed Backplane Links Clockless, high-speed interdevice communication across boards or backplanes using the built-in multi-gigabit transceivers.
- Line Card to Switch Fabric Connects Support for work and protection connections between line cards and switch fabric in telecom and networking equipment.
- Custom Protocol Termination Programmable logic to terminate proprietary network formats, perform cell processing, or translate between backplane protocols.
Unique Advantages
- Integrated High‑Speed Transceivers: Built-in 0.6–2.7 Gbps SERDES with CDR reduce external components and simplify high-speed link design.
- Substantial Logic and Memory: 10,368 logic elements combined with ~0.114 Mbits of embedded RAM provide the resources needed for protocol logic, buffering, and custom processing.
- High I/O Count: 204 user I/Os enable multiple parallel interfaces and dense board-level connectivity without added IO expanders.
- Industrial Reliability: −40 °C to 85 °C operating range and RoHS compliance support deployment in industrial networking and communications systems.
- Compact BGA Package: 484-ball FBGA (23 × 23 mm) offers a high-density, serviceable footprint compatible with modern PCB layouts.
- Flexible Power Options: Wide supply range (1.425 V to 3.6 V) adapts to varied system power architectures and rail configurations.
Why Choose ORSO42G5-2BMN484I?
The ORSO42G5-2BMN484I positions itself as a highly integrated FPGA solution for systems that require multi-gigabit serial connectivity, significant programmable logic, and compact packaging. Its combination of integrated SERDES channels, recovered clocking, and FPGA fabric enables designers to implement SONET/SDH framing, custom protocol logic, and high-speed backplane links with fewer external components.
This device is well suited for designers of telecommunications line cards, backplane routers, and network interface modules who need a robust industrial-grade component backed by the ORCA Series 4 architecture and associated development tools referenced in the product documentation.
Request a quote or submit a procurement inquiry to begin specifying ORSO42G5-2BMN484I for your next high-speed communications or backplane design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016