ORSO42G5-2BMN484I

IC FPGA 204 I/O 484FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA

Quantity 47 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BBGANumber of I/O204Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORSO42G5-2BMN484I – ORCA® 4 FPGA, 204 I/O, ~0.114 Mbit RAM, 10,368 logic elements, 484-BBGA

The ORSO42G5-2BMN484I is an ORCA® Series 4 field-programmable gate array (FPGA) device optimized for high-speed backplane interfaces and embedded logic integration. Built on Lattice’s Series 4 reconfigurable embedded SoC architecture, the device combines FPGA fabric, embedded memory, and integrated high-speed SERDES channels to address demanding communications and networking designs.

Targeted use cases include SONET/SDH and other high-speed backplane applications where integrated clock and data recovery, multi-gigabit serial channels, and substantial logic resources are required. The device offers a balance of logic capacity, embedded RAM, and I/O density in a compact 484-ball BGA package for industrial-grade systems.

Key Features

  • FPGA Logic Capacity  Provides 10,368 logic elements for implementing custom packet handling, protocol logic, and system glue logic.
  • Embedded Memory  Approximately 0.114 Mbits (113,664 bits) of on-chip RAM to support buffering, FIFOs, and small lookup tables within the FPGA fabric.
  • High-speed Serial Interfaces  Integrated SERDES channels (0.6 to 2.7 Gbps per channel) with built-in clock and data recovery—designed for high-speed backplane and interdevice communication.
  • I/O Density  204 user I/O pins to support complex board-level interfaces and multiple high-speed links.
  • System Gate Equivalent  System gate count up to 643,000 to represent the usable logic capacity for system-level designs.
  • Package and Mounting  484-ball FBGA (23 × 23 mm) surface-mount package for compact board integration and reliable solder connection.
  • Voltage and Power  Flexible supply range from 1.425 V to 3.6 V to fit a variety of board power architectures.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
  • Standards and Compliance  RoHS-compliant manufacturing to meet environmental and regulatory requirements.

Typical Applications

  • SONET/SDH Backplane Interfaces  Implement STS/STM framing, scrambling/descrambling, and Transport Overhead handling with integrated SERDES and CDR functions.
  • High‑speed Backplane Links  Clockless, high-speed interdevice communication across boards or backplanes using the built-in multi-gigabit transceivers.
  • Line Card to Switch Fabric Connects  Support for work and protection connections between line cards and switch fabric in telecom and networking equipment.
  • Custom Protocol Termination  Programmable logic to terminate proprietary network formats, perform cell processing, or translate between backplane protocols.

Unique Advantages

  • Integrated High‑Speed Transceivers: Built-in 0.6–2.7 Gbps SERDES with CDR reduce external components and simplify high-speed link design.
  • Substantial Logic and Memory: 10,368 logic elements combined with ~0.114 Mbits of embedded RAM provide the resources needed for protocol logic, buffering, and custom processing.
  • High I/O Count: 204 user I/Os enable multiple parallel interfaces and dense board-level connectivity without added IO expanders.
  • Industrial Reliability: −40 °C to 85 °C operating range and RoHS compliance support deployment in industrial networking and communications systems.
  • Compact BGA Package: 484-ball FBGA (23 × 23 mm) offers a high-density, serviceable footprint compatible with modern PCB layouts.
  • Flexible Power Options: Wide supply range (1.425 V to 3.6 V) adapts to varied system power architectures and rail configurations.

Why Choose ORSO42G5-2BMN484I?

The ORSO42G5-2BMN484I positions itself as a highly integrated FPGA solution for systems that require multi-gigabit serial connectivity, significant programmable logic, and compact packaging. Its combination of integrated SERDES channels, recovered clocking, and FPGA fabric enables designers to implement SONET/SDH framing, custom protocol logic, and high-speed backplane links with fewer external components.

This device is well suited for designers of telecommunications line cards, backplane routers, and network interface modules who need a robust industrial-grade component backed by the ORCA Series 4 architecture and associated development tools referenced in the product documentation.

Request a quote or submit a procurement inquiry to begin specifying ORSO42G5-2BMN484I for your next high-speed communications or backplane design.

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