ORSO82G5-1FN680C

IC FPGA 372 I/O 680FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA

Quantity 1,088 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package680-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case680-BBGANumber of I/O372Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORSO82G5-1FN680C – ORCA® 4 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA

The ORSO82G5-1FN680C is an ORCA® Series 4 reconfigurable embedded System-on-a-Chip (SoC) FPGA optimized for high-speed backplane and board-to-board interfaces. Built with integrated high-speed SERDES channels and a substantial FPGA fabric, it targets applications requiring multi-gigabit serial links and flexible programmable logic for SONET and other backplane protocols.

This device combines eight integrated SERDES channels (0.6–2.7 Gbps) with clock-and-data-recovery (CDR) circuitry and a sizable programmable fabric, enabling configurable high-throughput interconnects, protocol handling, and custom packet or cell processing on a single surface-mount 680-BBGA package.

Key Features

  • Series 4 FPGA architecture — Reconfigurable embedded SoC architecture with 10,368 logic elements for implementing protocol logic, custom datapaths, and control functions.
  • High-speed SERDES — Eight integrated serial channels operating from 0.6 to 2.7 Gbps with built-in Clock and Data Recovery (CDR) to support high-speed backplane links and reduced clock routing complexity.
  • Aggregate bandwidth — Designed to deliver aggregate serial bandwidth consistent with high-throughput backplane applications (ORSO82G5 family supports aggregate bandwidths referenced in the product family documentation).
  • Embedded memory — Total on-chip RAM of 113,664 bits (approximately 0.114 Mbits), with the datasheet noting two 4K × 36 RAM blocks in the embedded core that are accessible by FPGA logic.
  • I/O and package — 372 user I/O pins in a 680-ball FBGA package (680-FPBGA, 35 × 35 mm) for high pin-count system interconnects; surface-mount mounting type.
  • Logic and gate capacity — Approximately 643,000 system gates (per family gate-count range) enabling substantial on-chip integration of protocol and application logic.
  • Power and thermal — Supports a wide supply range from 1.425 V to 3.6 V and is rated for commercial operating temperatures from 0 °C to 70 °C.
  • Standards and compliance — RoHS-compliant manufacturing for environmental regulatory alignment.
  • SONET/SDH functionality (family-level) — Family documentation describes built-in SONET scrambler/descrambler, streamlined SONET framing and limited Transport OverHead (TOH) handling suitable for SONET backplane implementations when used with protocol logic.

Typical Applications

  • Telecom backplanes — Implement high-speed SONET/SDH or non-SONET backplane interfaces using integrated SERDES channels and programmable framing logic.
  • Switch fabric interconnects — Support board-to-board high-throughput links for work and protection paths in line-card to fabric connections.
  • High-speed data transport — Provide aggregated multi-gigabit backplane links and protocol termination with on-chip logic for packet or cell processing.

Unique Advantages

  • Integrated high-speed transceivers: Eight 0.6–2.7 Gbps SERDES channels with CDR reduce external PHY requirements and simplify timing distribution across boards and backplanes.
  • Substantial programmable fabric: 10,368 logic elements and an estimated system gate range suitable for implementing protocol engines, framers, and custom datapaths on-chip.
  • High pin count and compact package: 372 user I/Os in a 680-FPBGA (35 × 35 mm) package enable dense system routing and flexible I/O assignments.
  • Embedded memory accessibility: On-chip RAM (113,664 bits) plus embedded core RAM blocks accessible to FPGA logic help support buffering, FIFOs, and state storage without external memory.
  • Flexible power options: Broad supply voltage support from 1.425 V to 3.6 V accommodates diverse system power architectures.
  • Commercial-grade and RoHS compliant: Rated for 0 °C to 70 °C operation and RoHS-compliant, aligning with commercial telecom and networking equipment requirements.

Why Choose ORSO82G5-1FN680C?

The ORSO82G5-1FN680C positions itself as a high-density, high-speed FPGA solution for designers building backplane and board-to-board interfaces. With eight integrated SERDES channels, built-in CDR, extensive I/O, and a sizable logic fabric, it enables consolidation of protocol termination, framing and custom processing into a single surface-mount package.

This device is suited for telecommunications and networking applications that require configurable high-throughput links combined with programmable logic. Supported by the family documentation and development resources referenced in the product literature, the ORSO82G5-1FN680C offers a path to scalable, integrated designs for commercial networking equipment.

Request a quote or submit an inquiry to receive pricing and availability for ORSO82G5-1FN680C and discuss how it can fit into your next high-speed backplane or switch fabric design.

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