ORSO82G5-1FN680I
| Part Description |
ORCA® 4 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA |
|---|---|
| Quantity | 1,203 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 680-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 680-BBGA | Number of I/O | 372 | Voltage | 1.425 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 10368 | ||
| Number of Gates | 643000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of ORSO82G5-1FN680I – ORCA® 4 Field Programmable Gate Array (FPGA) IC, 680‑BBGA
The ORSO82G5-1FN680I is an ORCA® Series 4 reconfigurable embedded System-on-a-Chip FPGA targeted at high-speed backplane and interdevice communication. Built on Lattice’s Series 4 architecture, this device integrates FPGA fabric with multi‑Gbps serial transceivers to address SONET and other high-speed backplane interfaces.
Key value comes from its integrated SERDES channels with clock recovery, substantial on‑chip logic and memory resources, and a high pin‑count 680‑FBGA package—delivering a compact, industrial‑grade solution for demanding board and backplane designs.
Key Features
- Series 4 FPGA Architecture – 1,296 programmable functional units providing 10,368 logic elements and an FPGA system gate range up to 643,000 gates for complex logic integration.
- High‑Speed Serial Transceivers – Eight integrated SERDES channels supporting 0.6 to 2.7 Gbps with built‑in Clock and Data Recovery (CDR); aggregate bandwidth above 20 Gbps for multi‑lane backplane links.
- Embedded Memory – Approximately 0.114 Mbits (113,664 bits) of total on‑chip RAM plus two 144K‑bit RAM blocks in the embedded core that are accessible by FPGA logic for buffering and packet processing.
- I/O and Package – Up to 372 user I/O in a 680‑FBGA (35 × 35 mm) package; surface‑mount package supports high‑density board designs.
- Power and Temperature – Flexible supply range from 1.425 V to 3.6 V and industrial operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
- System Integration – Embedded features for SONET data handling (scrambling/descrambling, framing and limited TOH) and compatibility with related ORT devices; intended for configurable backplane termination and protocol handling.
- Regulatory – RoHS compliant.
Typical Applications
- SONET/SDH Backplane Interfaces – Ideal for terminating and processing SONET streams with integrated scrambling, framing and clock recovery across multiple high‑speed channels.
- High‑Speed Backplane Links – Use the multi‑Gbps SERDES and CDR to create clockless, high‑bandwidth connections between line cards and switch fabrics or between boards.
- Line Card to Switch Fabric Connectivity – Supports work and protection connections using multiple SERDES lanes to deliver aggregated bandwidth for fabric interfacing.
- Custom Packet and Cell Processing – Embedded RAM and FPGA fabric enable framing, cell processing and protocol access logic for proprietary or standardized data formats.
Unique Advantages
- Integrated High‑Speed Transceivers: Eight built‑in 0.6–2.7 Gbps SERDES channels with CDR reduce external PHY requirements and simplify backplane design.
- Substantial FPGA Capacity: 10,368 logic elements and up to ~643k system gates support complex custom logic and protocol offload on a single device.
- Accessible Embedded Memory: Approximately 0.114 Mbits of embedded RAM plus two 144K‑bit core RAM blocks provide on‑chip buffering and packet storage.
- High I/O Count in Compact Package: 372 user I/O in a 680‑FBGA (35 × 35 mm) gives dense connectivity while keeping board area compact.
- Industrial‑Grade Operating Range: −40 °C to 85 °C and broad supply range (1.425 V–3.6 V) enable reliable operation across typical industrial environments.
- Design Ecosystem Support: Documented compatibility with Lattice development tools and the FPSC design kit facilitates integration and development workflows.
Why Choose ORSO82G5-1FN680I?
The ORSO82G5-1FN680I combines Series 4 FPGA fabric with multi‑Gbps SERDES and embedded memory to deliver a single‑chip solution for high‑bandwidth backplane and interboard communication tasks. Its blend of logic capacity, dedicated serial channels with CDR, and a high I/O count in a 680‑FBGA package makes it suitable for line cards, switch fabrics and SONET/SDH interface applications that require integrated protocol handling and scalable bandwidth.
Designed for engineers who need on‑board packet/cell processing and robust backplane links, this industrial‑grade device provides a predictable, supported platform for system designs that demand high throughput and flexible programmable logic—backed by Lattice’s Series 4 documentation and toolchain support.
Request a quote or submit a sales inquiry to receive availability and pricing information for the ORSO82G5-1FN680I.

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