ORSO82G5-1FN680I

IC FPGA 372 I/O 680FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA

Quantity 1,203 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package680-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case680-BBGANumber of I/O372Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORSO82G5-1FN680I – ORCA® 4 Field Programmable Gate Array (FPGA) IC, 680‑BBGA

The ORSO82G5-1FN680I is an ORCA® Series 4 reconfigurable embedded System-on-a-Chip FPGA targeted at high-speed backplane and interdevice communication. Built on Lattice’s Series 4 architecture, this device integrates FPGA fabric with multi‑Gbps serial transceivers to address SONET and other high-speed backplane interfaces.

Key value comes from its integrated SERDES channels with clock recovery, substantial on‑chip logic and memory resources, and a high pin‑count 680‑FBGA package—delivering a compact, industrial‑grade solution for demanding board and backplane designs.

Key Features

  • Series 4 FPGA Architecture – 1,296 programmable functional units providing 10,368 logic elements and an FPGA system gate range up to 643,000 gates for complex logic integration.
  • High‑Speed Serial Transceivers – Eight integrated SERDES channels supporting 0.6 to 2.7 Gbps with built‑in Clock and Data Recovery (CDR); aggregate bandwidth above 20 Gbps for multi‑lane backplane links.
  • Embedded Memory – Approximately 0.114 Mbits (113,664 bits) of total on‑chip RAM plus two 144K‑bit RAM blocks in the embedded core that are accessible by FPGA logic for buffering and packet processing.
  • I/O and Package – Up to 372 user I/O in a 680‑FBGA (35 × 35 mm) package; surface‑mount package supports high‑density board designs.
  • Power and Temperature – Flexible supply range from 1.425 V to 3.6 V and industrial operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
  • System Integration – Embedded features for SONET data handling (scrambling/descrambling, framing and limited TOH) and compatibility with related ORT devices; intended for configurable backplane termination and protocol handling.
  • Regulatory – RoHS compliant.

Typical Applications

  • SONET/SDH Backplane Interfaces – Ideal for terminating and processing SONET streams with integrated scrambling, framing and clock recovery across multiple high‑speed channels.
  • High‑Speed Backplane Links – Use the multi‑Gbps SERDES and CDR to create clockless, high‑bandwidth connections between line cards and switch fabrics or between boards.
  • Line Card to Switch Fabric Connectivity – Supports work and protection connections using multiple SERDES lanes to deliver aggregated bandwidth for fabric interfacing.
  • Custom Packet and Cell Processing – Embedded RAM and FPGA fabric enable framing, cell processing and protocol access logic for proprietary or standardized data formats.

Unique Advantages

  • Integrated High‑Speed Transceivers: Eight built‑in 0.6–2.7 Gbps SERDES channels with CDR reduce external PHY requirements and simplify backplane design.
  • Substantial FPGA Capacity: 10,368 logic elements and up to ~643k system gates support complex custom logic and protocol offload on a single device.
  • Accessible Embedded Memory: Approximately 0.114 Mbits of embedded RAM plus two 144K‑bit core RAM blocks provide on‑chip buffering and packet storage.
  • High I/O Count in Compact Package: 372 user I/O in a 680‑FBGA (35 × 35 mm) gives dense connectivity while keeping board area compact.
  • Industrial‑Grade Operating Range: −40 °C to 85 °C and broad supply range (1.425 V–3.6 V) enable reliable operation across typical industrial environments.
  • Design Ecosystem Support: Documented compatibility with Lattice development tools and the FPSC design kit facilitates integration and development workflows.

Why Choose ORSO82G5-1FN680I?

The ORSO82G5-1FN680I combines Series 4 FPGA fabric with multi‑Gbps SERDES and embedded memory to deliver a single‑chip solution for high‑bandwidth backplane and interboard communication tasks. Its blend of logic capacity, dedicated serial channels with CDR, and a high I/O count in a 680‑FBGA package makes it suitable for line cards, switch fabrics and SONET/SDH interface applications that require integrated protocol handling and scalable bandwidth.

Designed for engineers who need on‑board packet/cell processing and robust backplane links, this industrial‑grade device provides a predictable, supported platform for system designs that demand high throughput and flexible programmable logic—backed by Lattice’s Series 4 documentation and toolchain support.

Request a quote or submit a sales inquiry to receive availability and pricing information for the ORSO82G5-1FN680I.

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