ORSO82G5-3FN680C

The ORSO82G5-3FN680C is an ORCA® Series 4 field programmable gate array (FPGA) device integrating programmable logic with high-speed serial transceivers. Built on Lattice’s Series 4 reconfigurable embedded SoC architecture, this device targets high-speed backplane and interboard communication tasks where multiple SERDES channels, on-chip memory and mid-range logic capacity are required.

Key value propositions include integrated 0.6–2.7 Gbps SERDES channels with clock and data recovery, aggregate bandwidth above 20 Gbps for the ORSO82G5 family, and a compact 680‑ball BGA package suitable for surface-mount assembly in commercial-temperature systems.

Key Features

• Series 4 Reconfigurable SoC Architecture Built on Lattice’s ORCA Series 4 architecture providing integrated programmable logic and embedded system resources.
• High‑Speed SERDES Eight integrated SERDES channels supporting 0.6 to 2.7 Gbps per channel with built-in Clock and Data Recovery (CDR), enabling clockless high-speed interdevice and backplane communication.
• Logic Capacity 1296 programmable function units (PFUs) equivalent to 10,368 logic elements for implementing custom protocol, framing or packet processing logic.
• Embedded Memory Approximately 0.11 Mbits of on‑chip RAM (total RAM bits: 113,664) with 12 embedded block RAM (EBR) resources for buffering and packet processing.
• I/O and Gate Count 372 user I/O pins and an FPGA system gate count up to 643,000 for substantial interfacing and logic integration.
• Supply and Thermal Operates from 1.425 V to 3.6 V and rated for commercial temperature operation from 0 °C to 70 °C.
• Package and Mounting 680‑ball Fine‑pitch BGA (680‑FPBGA, 35 × 35 mm) surface‑mount package suitable for board-level integration.
• Compliance RoHS‑compliant manufacturing status supports regulatory requirements for restricted substances.

Typical Applications

• High‑speed backplane interfaces: Implements SONET/SDH and non‑SONET backplane connectivity using integrated SERDES and CDR for streamlined clock domains and reduced backplane signal count.
• Packet and framer processing: Integrates SONET scrambling/descrambling, streamlined framing and limited Transport Overhead handling alongside custom packet or cell processing logic.
• Inter‑board data links: Provides clockless, high‑bandwidth links between line cards and switch fabrics, supporting 10 Gbps‑class backplane connectivity use cases.

Unique Advantages

• Integrated SERDES with CDR: Reduces external clocking complexity and minimizes backplane signal routing by providing built‑in clock recovery and high‑speed serial lanes.
• Balanced logic and memory resources: 10,368 logic elements combined with approximately 0.11 Mbits of embedded RAM and 12 EBR blocks support mixed protocol and buffering functions on a single device.
• High aggregate bandwidth: The ORSO82G5 family delivers aggregate bandwidth above 20 Gbps, enabling multi‑channel high‑throughput designs.
• Compact BGA package: 680‑ball FPBGA (35×35 mm) offers a high I/O count (372) and dense integration for space‑constrained board designs.
• Commercial grade and RoHS compliant: Designed for commercial temperature operation (0 °C to 70 °C) and RoHS‑compliant supply chain compatibility.

Why Choose ORSO82G5-3FN680C?

The ORSO82G5-3FN680C combines Series 4 FPGA logic density with integrated multi‑channel SERDES and embedded memory tailored for high‑speed backplane and interconnect applications. It is well suited for designers who need to consolidate framer, scrambler, and custom interface logic alongside high‑bandwidth serial links in a single commercial‑grade device.

With substantial I/O, on‑chip memory and a compact 680‑ball BGA footprint, this device supports scalable designs that benefit from integrated clock recovery and programmable logic—reducing external components while enabling flexible protocol handling and data processing on the line card or system board.

Request a quote or submit a procurement inquiry to evaluate ORSO82G5-3FN680C for your next high‑speed interface design.