ORSPI4-3F1156C

The ORSPI4-3F1156C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, provided in a 1156-BBGA surface-mount package. It delivers 2024 logic elements and up to 400 I/O in a compact 1156-FPBGA (35×35) footprint, making it suitable for commercial embedded designs that require moderate configurable logic and high I/O density.

With a wide supply voltage range and extended operating temperature window, this FPGA supports flexible interfacing and deployment across a range of commercial applications that require configurable digital logic and high pin-count connectivity.

Key Features

• Logic Capacity  Approximately 2024 logic elements for user-configurable logic and glue logic implementation.
• I/O Density  Up to 400 general-purpose I/O pins providing ample connectivity for peripherals, buses, and external interfaces.
• Package & Mounting  1156-BBGA supplier package (1156-FPBGA, 35×35) in a surface-mount form factor for high pin-count, board-level integration.
• Power Supply Flexibility  Wide voltage supply range from 1.425 V to 3.6 V to accommodate diverse I/O standards and mixed-voltage designs.
• Operating Range  Commercial grade device specified for operation from −40 °C to 125 °C.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded Systems  Use the FPGA to implement custom peripherals, protocol bridging, and glue logic where 2024 logic elements and high I/O count are required.
• Communications Interfaces  Provide configurable interface logic and pin-accurate connectivity for protocol conversion and high-density I/O routing.
• Consumer & Commercial Electronics  Integrate flexible control and interfacing capabilities in compact, surface-mount designs using the 1156-BBGA package.

Unique Advantages

• Balanced Logic Capacity: 2024 logic elements deliver a practical balance of configurable resources for medium-complexity designs without excessive footprint.
• High I/O Count: 400 I/O pins enable extensive peripheral and bus connections, reducing the need for external I/O expanders.
• Flexible Powering: A 1.425 V to 3.6 V supply range supports a variety of interface voltage requirements and mixed-voltage board designs.
• Compact, High-Pin Package: The 1156-FPBGA (35×35) package provides high pin density in a surface-mount form factor for space-constrained PCBs.
• Wide Operating Temperature: Specified operation from −40 °C to 125 °C offers thermal margin across many commercial deployment scenarios.
• Regulatory Readiness: RoHS compliance supports environmentally responsible manufacturing and procurement requirements.

Why Choose ORSPI4-3F1156C?

The ORSPI4-3F1156C positions itself as a commercial FPGA solution combining a practical logic element count with very high I/O capability in a compact BGA package. Its flexible supply voltage range and extended operating temperature make it a fit for designers seeking configurable logic and dense connectivity in commercial embedded products.

Backed by Lattice Semiconductor Corporation as the manufacturer, this part is suited to engineering teams needing a scalable, board-level FPGA option with clear, verifiable electrical and mechanical specifications for integration into production designs.

Request a quote or submit a quote request today to evaluate the ORSPI4-3F1156C for your next design.