ORSPI4-2F1156C

The ORSPI4-2F1156C is an ORCA® ORSPI4 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a configurable hardware platform in a compact 1156-BBGA package suitable for surface-mount assembly.

With 2024 logic elements and up to 400 I/O, the device is designed for applications that require moderate programmable logic capacity combined with substantial I/O density. It supports a wide supply voltage range of 1.425–3.6 V, operates from -40°C to 125°C, and is RoHS compliant.

Key Features

• Core and Architecture  ORCA® ORSPI4 FPGA architecture in a field-programmable IC offering 2024 logic elements for custom logic implementation.
• Logic & I/O  2024 logic elements and 400 I/O pins provide ample resources for glue logic, interface bridging, and parallel signal handling.
• Power  Flexible supply voltage range from 1.425 V to 3.6 V to accommodate multiple system power domains.
• Package & Mounting  1156-BBGA package (supplier device package: 1156-FPBGA, 35×35) in a surface-mount form factor to minimize board footprint.
• Operating Range  Rated for operation from -40°C to 125°C while specified as commercial grade.
• Environmental Compliance  RoHS compliant to support environmental regulatory requirements.

Typical Applications

• System Control and Glue Logic  Implement custom control paths and interface logic using the device’s 2024 logic elements and abundant I/O.
• I/O-Intensive Interfaces  Support parallel buses, multi-channel sensor arrays, or complex interfacing needs with 400 available I/Os.
• Prototyping and Development  Rapidly validate and iterate on custom logic and peripheral integration in a compact, surface-mount FPGA package.
• Peripheral Offload  Offload deterministic or timing-sensitive functions from host processors by implementing dedicated logic blocks on-chip.

Unique Advantages

• Configurable Logic Capacity: 2024 logic elements provide a balanced resource level for many mid-range FPGA tasks without overprovisioning.
• High I/O Density: 400 I/O pins enable complex interconnect and parallel signal handling, reducing the need for external bus expanders.
• Wide Supply Flexibility: Operates across 1.425–3.6 V to integrate with varied power domains and legacy interfaces.
• Compact, Assembly-Friendly Package: 1156-BBGA (35×35) surface-mount packaging reduces PCB area while supporting automated assembly processes.
• Regulatory Compliance: RoHS compliant to assist with environmental and regulatory requirements in product development.

Why Choose ORSPI4-2F1156C?

The ORSPI4-2F1156C positions itself as a practical FPGA choice for designers needing a moderate amount of programmable logic combined with a high I/O count in a compact BGA footprint. Its flexible supply voltage range and broad operating temperature span make it suitable for a variety of embedded and electronic system designs within its commercial grade.

Backed by Lattice Semiconductor Corporation, this device offers a straightforward, configurable hardware resource for system integration, prototyping, and interface consolidation where 2024 logic elements and extensive I/O are the primary requirements.

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