ORSO82G5-2FN680C

The ORSO82G5-2FN680C is an ORCA® Series 4 field programmable gate array (FPGA) device built on a reconfigurable embedded System-on-a-Chip architecture. It integrates high-speed serial transceivers and programmable FPGA fabric to address demanding backplane and interconnect applications.

Designed for applications that require multi‑Gbps links and substantial on‑chip logic, the device combines eight integrated 0.6–2.7 Gbps SERDES channels with 10,368 logic elements, 372 user I/O, and approximately 0.11 Mbits of embedded RAM to support SONET/SDH backplane interfaces and other high‑speed interdevice communications.

Key Features

• Series 4 SoC Architecture Reconfigurable embedded System‑on‑a‑Chip architecture providing integrated FPGA fabric and embedded core functionality.
• High‑speed SERDES Eight integrated SERDES channels supporting 0.6 to 2.7 Gbps per lane and aggregate bandwidth of over 20 Gbps for multi‑lane backplane links.
• Built‑in Clock and Data Recovery (CDR) Integrated CDR circuitry enables clockless high‑speed interfaces and simplifies multiboard clocking domains.
• Logic Capacity 10,368 logic elements to implement protocol logic, framing, packet handling, and custom processing functions.
• Embedded Memory Approximately 0.11 Mbits of on‑chip RAM to support buffering, packet processing, and firmware runtimes.
• I/O and Interfaces 372 user I/O pins for flexible system interfacing and high‑density backplane connections.
• Package and Mounting 680‑BBGA package (680‑FPBGA, 35 × 35 mm) with surface‑mount assembly for compact, high‑density board designs.
• Power and Temperature Supply voltage range of 1.425 V to 3.6 V and commercial operating temperature range of 0 °C to 70 °C.
• Design and Tooling Support Device references in the product datasheet include support for the ispLEVER development system and an FPSC design kit to aid design integration.
• Regulatory RoHS compliant.

Typical Applications

• SONET/SDH Backplane Interfaces Implement STS/STM framing, scrambling/descrambling and linked SONET functions using the integrated SERDES and programmable logic.
• High‑speed Backplane Interconnects Provide multi‑Gbps inter‑card links and 10 Gbps class backplane connections between line cards and switch fabrics using eight high‑speed channels.
• Interdevice Board‑to‑Board Communication Enable clockless, high‑bandwidth links across a board or backplane with built‑in clock recovery to reduce backplane signal count and simplify clock domains.
• Protocol Termination and Data Framing Use the FPGA fabric alongside embedded functions for framers, Packet‑over‑SONET (PoS) interfaces, and custom packet processing logic.

Unique Advantages

• Integrated High‑speed Transceivers: Eight 0.6–2.7 Gbps SERDES lanes with CDR reduce external PHY requirements and simplify high‑speed link design.
• Substantial Logic Resource: 10,368 logic elements enable implementation of complex protocol logic and custom processing without external ASICs.
• Compact, High‑density Package: 680‑BBGA (35 × 35 mm) package provides high I/O density for dense backplane and board layouts.
• Flexible Power Range: Broad supply voltage support (1.425 V to 3.6 V) accommodates a range of system designs and I/O standards.
• Development Ecosystem: Datasheet references to ispLEVER and FPSC design kit support accelerate development and system integration.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose ORSO82G5-2FN680C?

The ORSO82G5-2FN680C positions itself as a purpose‑built ORCA® Series 4 FPGA for designers needing integrated, multi‑Gbps backplane interfaces combined with programmable logic capacity. Its combination of eight high‑speed SERDES channels, built‑in CDR, more than 10,000 logic elements, and hundreds of I/O pins makes it well suited to SONET/SDH backplane termination, high‑bandwidth interconnects, and custom protocol implementations.

For engineering teams building line cards, switch fabric links, or board‑level interconnects, this device provides a balance of integration, performance, and development support to streamline system design and reduce external component count.

Request a quote or contact sales to discuss availability, pricing, and design‑in support for ORSO82G5-2FN680C.