ORSO82G5-2FN680I

The ORSO82G5-2FN680I is an ORCA® Series 4 FPGA-class device built for high-speed backplane and interdevice communication. Based on Lattice’s Series 4 reconfigurable embedded System-on-a-Chip architecture, this device integrates programmable logic with high-speed serial transceivers and on-chip memory for SONET and other backplane interface applications.

Designed for industrial-grade systems, the ORSO82G5-2FN680I delivers a combination of high I/O count, significant logic capacity and integrated SERDES channels to support multi-gigabit aggregate bandwidth and complex protocol termination on board-level or backplane links.

Key Features

• Programmable Logic  10,368 logic elements suitable for implementing custom protocol, framing or packet processing logic.
• High-Speed Serial Interfaces  Eight integrated SERDES channels supporting 0.6–2.7 Gbps per lane with built-in Clock and Data Recovery (CDR), enabling aggregate multi-gigabit backplane links.
• Embedded Memory  Total on-chip RAM of 113,664 bits (approximately 0.114 Mbits) for buffering, frame storage and packet processing.
• I/O Density  372 user I/O pins to support wide parallel interfaces and dense board-level interconnects.
• Logic Capacity  System gate count listed at 643,000 gates for implementing complex designs and integration of protocol and access logic.
• Power and Supply  Wide supply range from 1.425 V to 3.6 V to accommodate different board power architectures.
• Package & Mounting  680‑BBGA package (680‑FPBGA, 35 × 35 mm) in a surface-mount form factor for high-density PCB assemblies.
• Industrial Grade  Rated for operation from −40 °C to 85 °C suitable for industrial environments.
• Standards & Compliance  RoHS compliant.

Typical Applications

• Telecommunications Backplanes  SONET/SDH backplane interfaces and termination, leveraging integrated scrambling/descrambling, framing and CDR-enabled SERDES channels.
• High-Speed Board-to-Board Links  Multi-gigabit interconnect between line cards and switch fabrics using the device’s 0.6–2.7 Gbps transceivers.
• Network Interface Processing  Packet and cell processing on-board with embedded memory and ample logic resources to implement protocol access and custom logic.
• 10 Gbps Backplane Connectivity  Support for creating full 10 Gbps data connections across a backplane using multiple high-speed lanes and programmable logic.

Unique Advantages

• Integrated High-Speed SERDES: Eight CDR-equipped lanes reduce the need for external transceiver components and simplify high-speed link design.
• Substantial Logic and Gate Count: 10,368 logic elements and up to 643,000 gates provide headroom for complex protocol stacks and custom processing blocks.
• High I/O Count for Dense Systems: 372 user I/O pins allow flexible interfacing to parallel buses, control planes and diverse peripheral signals.
• Industrial Temperature Range: Rated from −40 °C to 85 °C to meet the demands of industrial networking and telecom equipment.
• Compact, High‑Density Package: 680‑BBGA (35 × 35 mm) surface-mount package supports high pin count in a board-optimized footprint.
• RoHS Compliant: Conforms to RoHS requirements for environmental and regulatory compatibility in commercial and industrial products.

Why Choose ORSO82G5-2FN680I?

The ORSO82G5-2FN680I positions itself as a robust, industrial-grade FPGA-class solution for designers needing integrated high-speed serial I/O with considerable programmable logic and embedded memory. Its combination of eight 0.6–2.7 Gbps SERDES channels, 10,368 logic elements and 372 user I/O makes it well suited for SONET backplane termination, board-to-board links and other multi-gigabit system interfaces.

With a broad supply voltage window, surface-mount 680‑BBGA packaging, and operating range suited for industrial environments, this device supports scalable, long-term designs that require on-board protocol handling, buffering and flexible I/O topologies while remaining RoHS compliant.

Request a quote or submit your specifications to get pricing and availability for the ORSO82G5-2FN680I. Our team can help evaluate fit for your backplane and high-speed interface requirements.