ORSPI4-2FN1156C

FPGA, 2024 CLBS, 471000 GATES
Part Description

ORCA® ORSPI4 Field Programmable Gate Array (FPGA) IC 1156-BBGA

Quantity 766 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FPBGA (35x35)GradeCommercialOperating Temperature-40°C – 125°C
Package / Case1156-BBGANumber of I/O400Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2024Number of Logic Elements/Cells2024
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM BitsN/A

Overview of ORSPI4-2FN1156C – ORCA® ORSPI4 FPGA, 1156-BBGA

The ORSPI4-2FN1156C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, supplied in a 1156-BBGA package. It provides programmable logic resources and flexible I/O capacity for commercial embedded designs, supporting a wide supply voltage range and extended operating temperatures for deployment across a variety of commercial applications.

Key Features

  • Programmable Logic  2024 logic elements provide the programmable fabric for implementing custom logic, control, and interface functions.
  • I/O Density  Up to 400 I/O pins support high pin-count interfacing for complex peripheral and bus connectivity requirements.
  • Supply Voltage Flexibility  Operates from 1.425 V to 3.6 V, enabling compatibility with multiple core and I/O voltage domains.
  • Package and Mounting  Supplied in a 1156-BBGA (supplier device package: 1156-FPBGA, 35×35 mm) surface-mount package for compact, high-density board designs.
  • Thermal Range  Rated to operate from -40°C to 125°C, enabling use across a broad ambient temperature span.
  • Grade and Compliance  Commercial-grade device with RoHS compliance to meet lead-free assembly requirements.

Typical Applications

  • Commercial Embedded Systems  Use the FPGA’s programmable logic and 400 I/Os to implement custom control, protocol bridging, and I/O consolidation in commercial devices.
  • Interface and Peripheral Integration  High I/O count and flexible supply range make the device suitable for integrating multiple digital interfaces and peripherals on a single board.
  • Prototyping and Custom Logic  The 2024 logic elements allow designers to prototype and iterate custom digital functions without committing to fixed silicon.

Unique Advantages

  • High I/O capability: 400 I/Os reduce the need for external multiplexers and simplify board-level connectivity.
  • Flexible power integration: Wide 1.425 V to 3.6 V supply range supports mixed-voltage system architectures.
  • Compact BGA footprint: 1156-BBGA (35×35 mm) package enables dense board layouts while maintaining high pin counts.
  • Broad operating temperature: -40°C to 125°C rating supports deployment across varied commercial environments.
  • Regulatory readiness: RoHS compliance supports modern, lead-free manufacturing processes.

Why Choose ORSPI4-2FN1156C?

The ORSPI4-2FN1156C delivers a balanced combination of programmable resources, I/O density, and packaging suited for commercial embedded designs that require flexible logic integration. With 2024 logic elements and up to 400 I/Os housed in a 1156-BBGA package, it provides a practical platform for consolidating interfaces and implementing custom functions while supporting a broad supply voltage range and extended temperature operation.

Designers and procurement teams seeking a commercially graded FPGA option with RoHS compliance and robust electrical flexibility will find the ORSPI4-2FN1156C suitable for a wide range of board-level integration tasks and iterative development cycles.

Request a quote or submit an RFQ today to check availability and pricing for ORSPI4-2FN1156C.

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