ORT42G5-1BM484I

IC FPGA 204 I/O 484FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA

Quantity 235 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
DatasheetN/A

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BBGANumber of I/O204Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORT42G5-1BM484I – ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA

The ORT42G5-1BM484I is an ORCA® family FPSC device built on Lattice’s Series 4 reconfigurable embedded System-on-a-Chip architecture. It integrates a 4-channel SERDES backplane transceiver with FPGA fabric to address high-speed serial backplane data transmission and related network interface designs.

Targeted for networking and communications systems, the device supports XAUI and Fibre Channel protocol building blocks and includes on-chip clock-and-data recovery and transmitter preemphasis to simplify high-speed link design and integration.

Key Features

  • Series 4 Reconfigurable SoC Architecture — Combines an embedded core with FPGA fabric to support system-level integration and application-specific logic.
  • High-speed SERDES (4 channels) — Four transceiver channels operating up to 3.7 Gbps across 26 inches of FR-4 backplane with built-in Rx Clock and Data Recovery (CDR) and transmitter preemphasis.
  • Logic Capacity — Approximately 10,368 logic elements for implementing custom datapaths and control logic.
  • Embedded Memory — Total on-chip RAM of 113,664 bits (approximately 0.114 Mbits) and 12 embedded block RAM (EBR) resources for buffering and state storage.
  • Protocol Support — Built-in 8b/10b encoding/decoding and link state machines for 10G Ethernet and Fibre Channel use cases, plus XAUI support for backplane interfaces.
  • I/O and Package — 204 user I/O pins in a 484-BBGA (484-FPBGA, 23×23 mm) package for dense board-level integration.
  • Performance Range — Device system gate capacity up to 643,000 gates as reported for the ORCA family implementation.
  • Power and Supply Flexibility — Supports voltage supply range from 1.425 V to 3.6 V to accommodate multiple rail configurations.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for industrial applications.
  • Surface Mount Package — 484-ball FPBGA surface-mount package for standard PCB assembly.

Typical Applications

  • Network Backplanes — Implements high-speed, clockless interdevice links and termination devices for board-to-board or backplane communication.
  • 10G Ethernet and XAUI Interfaces — Provides SERDES channels with 8b/10b support and link state machines to build XAUI/XGMII bridges and 10G backplane connections.
  • Fibre Channel and Storage Networking — Supports Fibre Channel protocol elements and link management for SAN and storage interface designs.
  • High-speed Data Transport — Acts as a platform for implementing multi-channel alignment FIFOs, clock recovery, and protocol processing in high-bandwidth systems.

Unique Advantages

  • Integrated High-speed Transceivers: Four SERDES channels with CDR and preemphasis reduce external PHY requirements and simplify backplane link design.
  • On-chip Protocol Building Blocks: Embedded 8b/10b encoding/decoding and link state machines accelerate development of Ethernet and Fibre Channel links.
  • Balanced Logic and Memory: 10,368 logic elements combined with approximately 0.114 Mbits of RAM and 12 EBRs provide flexibility for buffering, packet processing and control logic.
  • Industrial Temperature Rating: −40 °C to 85 °C operation supports deployment in industrial networking equipment and infrastructure.
  • Compact, High-density Package: 484-BBGA (23×23 mm) package supports high I/O count (204 pins) while minimizing board footprint.
  • Flexible Power Choices: Broad supply range (1.425 V–3.6 V) enables use in varied system architectures and voltage domains.

Why Choose ORT42G5-1BM484I?

The ORT42G5-1BM484I is positioned for designers who need an integrated solution for high-speed backplane communication with on-chip protocol support. Its combination of four high-performance SERDES channels, substantial logic capacity, embedded memory, and industrial temperature rating makes it suitable for networking, storage, and data-transport applications where compact integration and reliable high-speed links matter.

Choosing this device provides a pathway to consolidate transceiver functionality and FPGA logic into a single package, simplifying board-level design and accelerating development cycles for systems that require XAUI, 10G Ethernet, or Fibre Channel building blocks.

Request a quote or submit an inquiry to start the procurement process for the ORT42G5-1BM484I and discuss availability and lead times.

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