ORSO42G5-3BM484C
| Part Description |
ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA |
|---|---|
| Quantity | 1,318 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 204 | Voltage | 1.425 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 10368 | ||
| Number of Gates | 643000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of ORSO42G5-3BM484C – ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA
The ORSO42G5-3BM484C is an ORCA Series 4 FPGA-class device from Lattice Semiconductor designed for high‑speed backplane interfacing. Built on a reconfigurable embedded System-on-a-Chip architecture, the device integrates high‑speed serial transceivers and programmable logic to support SONET and other high‑bandwidth backplane applications.
Key on‑chip resources include 1296 programmable function units, 10,368 logic elements, approximately 113,664 bits of embedded RAM, and 204 user I/Os—all packaged in a compact 484‑BBGA (484‑FPBGA, 23×23) surface‑mount package. The ORSO42G5 family supports aggregate bandwidths of over 10 Gbps for multi‑channel high‑speed links.
Key Features
- Integrated High‑Speed SERDES and CDR — Four 0.6–2.7 Gbps SERDES channels with built‑in Clock and Data Recovery for clockless high‑speed interdevice communication and backplane links.
- Programmable Logic Capacity — 1,296 programmable function units and 10,368 logic elements provide flexible implementation of protocol logic, framing, and custom datapath functions.
- On‑Chip Memory — Approximately 113,664 bits of embedded RAM for packet buffering, FIFOs and small‑scale frame processing.
- Rich I/O and Packaging — 204 user I/Os in a 484‑BBGA (484‑FPBGA 23×23) surface‑mount package to support diverse board‑level connections.
- System‑Level Interfaces — Features and data sheet content describe SONET framing, scrambling/descrambling, and streamlined transport handling suited to backplane network termination and protocol offload.
- Voltage and Temperature — Operates from 1.425 V to 3.6 V and rated for commercial ambient temperatures (0 °C to 70 °C).
- Manufacturing and Compliance — Surface‑mount package with RoHS compliance for lead‑free assembly processes.
Typical Applications
- SONET/SDH Backplane Interfaces — Implement STS/STM framing, scrambling and limited transport overhead handling for backplane termination and protocol processing.
- High‑Speed Backplane Links — Provide multi‑channel 0.6–2.7 Gbps links for line card to switch fabric interconnects and board‑to‑board communication with aggregate bandwidths above 10 Gbps.
- Network Termination and Protocol Offload — Use integrated serial transceivers and programmable logic to offload framing, cell processing, and access logic from host processors.
- Proprietary Interconnects — Bridge proprietary formats across a high‑speed backplane using the device’s programmable datapath and serial link capabilities.
Unique Advantages
- Integrated Transceiver + Logic: Combines multi‑Gbps SERDES with programmable logic to reduce external component count and simplify backplane design.
- Balanced Resource Set: 10,368 logic elements, 1296 PFUs and ~113.7 Kbits of RAM provide a practical mix of compute and storage for protocol and framing tasks.
- Compact, High‑I/O Package: 204 user I/Os in a 484‑BBGA 23×23 footprint enables dense routing for modern line‑card layouts.
- Wide Supply Range: 1.425 V to 3.6 V support allows flexible interfacing to different board power domains and I/O standards.
- Designed for Backplane Use: Architecture and feature set target SONET and non‑SONET backplane applications, enabling clockless high‑speed links and simplified multi‑board clock domains.
- RoHS Compliant: Conforms to RoHS requirements for lead‑free production environments.
Why Choose ORSO42G5-3BM484C?
The ORSO42G5-3BM484C positions itself as a highly integrated solution for designers building high‑speed backplane interfaces and network termination devices. Its combination of multi‑Gbps SERDES channels with embedded CDR, sizeable programmable logic, and onboard RAM makes it suitable for implementations that require protocol processing, framing and reliable interboard connectivity.
Engineers and procurement teams benefit from a clear, verifiable spec set—204 I/Os, approximately 10,368 logic elements, ~113,664 bits of embedded RAM, a commercial temperature rating, and a compact 484‑BBGA surface‑mount package—providing predictable integration into existing board designs and development flows.
Request a quote or contact sales to discuss availability, pricing, and how the ORSO42G5-3BM484C can fit your next high‑speed backplane or network interface design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016