ORSO42G5-2BM484C

IC FPGA 204 I/O 484FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA

Quantity 1,375 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O204Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORSO42G5-2BM484C – ORCA® 4 FPGA, 204 I/Os, 10,368 Logic Elements, 484-BBGA

The ORSO42G5-2BM484C is an ORCA® Series 4 field-programmable gate array (FPGA) IC built on Lattice’s Series 4 reconfigurable embedded System-on-a-Chip (SoC) architecture. It combines programmable FPGA logic with integrated high-speed transceivers and SONET/SDH-oriented processing to deliver configurable backplane interfaces and board-level high-speed links.

Targeted for designers of high-speed backplane and network interface applications, the device delivers four integrated SERDES channels with built-in clock and data recovery and aggregate bandwidth greater than 10 Gbps, along with 10,368 logic elements and significant on-chip memory for protocol and custom logic implementation.

Key Features

  • Core Logic  10,368 logic elements (cells) supporting flexible programmable logic implementation; device-level gate count up to 643,000 system gates.
  • Embedded Memory  Approximately 113,664 bits of embedded RAM available for FIFOs, buffers and protocol state.
  • High‑Speed Transceivers  Four integrated 0.6–2.7 Gbps SERDES channels with built-in Clock and Data Recovery (CDR); aggregate bandwidth in excess of 10 Gbps for backplane and board-level links.
  • SONET/SDH Support  On-chip support for SONET functions including scrambling/descrambling, streamlined framing and limited TOH handling for building SONET backplane interfaces.
  • I/O and Packaging  204 user I/Os in a 484‑BBGA surface-mount package (supplier package: 484-FPBGA, 23×23 mm) for dense board-level connectivity.
  • Power and Temperature  Supply voltage range from 1.425 V to 3.6 V and a commercial operating temperature range of 0 °C to 70 °C.
  • Compliance  RoHS‑compliant manufacturing.
  • Design Ecosystem  Supported by the ORCA FPSC family development resources and ispLEVER toolchain references described in the product datasheet.

Typical Applications

  • SONET Backplane Interfaces  Implement STS/STM framing, scrambling and transport functions with integrated SERDES and CDR for SONET/SDH backplanes.
  • High‑Speed Backplane Interconnects  Provide clockless high-speed links between line cards or between line cards and switch fabrics using the device’s multi-channel SERDES.
  • Board-Level High‑Speed Data Transfer  Facilitate proprietary or non-SONET high-speed data transfers across a PCB or backplane leveraging the built-in transceivers and programmable logic.
  • Network Termination and Protocol Bridging  Terminate backplane links and implement protocol/access logic such as framers or Packet-over-SONET (PoS) interfaces within the programmable fabric.

Unique Advantages

  • Integrated High‑Speed PHY and FPGA:  Four 0.6–2.7 Gbps SERDES channels with CDR integrated alongside programmable logic reduce need for separate transceiver ICs while enabling high aggregate bandwidth.
  • SONET‑Ready Processing:  On-chip SONET features (scrambling, framing, limited TOH handling) simplify implementation of SONET/SDH interfaces without requiring external protocol processors.
  • Scalable Logic Capacity:  10,368 logic elements and up to 643,000 system gates provide headroom for protocol stacks, custom datapaths and buffering logic.
  • Dense I/O and Compact Package:  204 user I/Os in a 484‑BBGA (23×23 mm) package supports dense interconnect requirements in space-constrained board designs.
  • Flexible Supply Range:  Broad voltage support from 1.425 V to 3.6 V helps integration with various board power domains.
  • Commercial Temperature Operation:  Specified for 0 °C to 70 °C, suitable for standard commercial applications and environments.

Why Choose ORSO42G5-2BM484C?

The ORSO42G5-2BM484C positions itself as a configurable, high-speed FPGA solution for designers building SONET/SDH backplane interfaces and high-bandwidth board-level links. Its combination of integrated SERDES with CDR, substantial programmable logic (10,368 logic elements), and embedded memory (approximately 113,664 bits) provides a compact platform for implementing protocol termination, framing and custom packet handling functions.

Engineers can leverage the ORCA Series 4 architecture and available development resources to prototype and deploy backplane transceiver functions with a single device that balances I/O density, transceiver performance and programmable logic capacity for commercial applications.

Request a quote or submit an inquiry to purchase ORSO42G5-2BM484C and evaluate its fit for your high-speed backplane and network interface designs.

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