ORSO42G5-2BM484C
| Part Description |
ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA |
|---|---|
| Quantity | 1,375 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 204 | Voltage | 1.425 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 10368 | ||
| Number of Gates | 643000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of ORSO42G5-2BM484C – ORCA® 4 FPGA, 204 I/Os, 10,368 Logic Elements, 484-BBGA
The ORSO42G5-2BM484C is an ORCA® Series 4 field-programmable gate array (FPGA) IC built on Lattice’s Series 4 reconfigurable embedded System-on-a-Chip (SoC) architecture. It combines programmable FPGA logic with integrated high-speed transceivers and SONET/SDH-oriented processing to deliver configurable backplane interfaces and board-level high-speed links.
Targeted for designers of high-speed backplane and network interface applications, the device delivers four integrated SERDES channels with built-in clock and data recovery and aggregate bandwidth greater than 10 Gbps, along with 10,368 logic elements and significant on-chip memory for protocol and custom logic implementation.
Key Features
- Core Logic 10,368 logic elements (cells) supporting flexible programmable logic implementation; device-level gate count up to 643,000 system gates.
- Embedded Memory Approximately 113,664 bits of embedded RAM available for FIFOs, buffers and protocol state.
- High‑Speed Transceivers Four integrated 0.6–2.7 Gbps SERDES channels with built-in Clock and Data Recovery (CDR); aggregate bandwidth in excess of 10 Gbps for backplane and board-level links.
- SONET/SDH Support On-chip support for SONET functions including scrambling/descrambling, streamlined framing and limited TOH handling for building SONET backplane interfaces.
- I/O and Packaging 204 user I/Os in a 484‑BBGA surface-mount package (supplier package: 484-FPBGA, 23×23 mm) for dense board-level connectivity.
- Power and Temperature Supply voltage range from 1.425 V to 3.6 V and a commercial operating temperature range of 0 °C to 70 °C.
- Compliance RoHS‑compliant manufacturing.
- Design Ecosystem Supported by the ORCA FPSC family development resources and ispLEVER toolchain references described in the product datasheet.
Typical Applications
- SONET Backplane Interfaces Implement STS/STM framing, scrambling and transport functions with integrated SERDES and CDR for SONET/SDH backplanes.
- High‑Speed Backplane Interconnects Provide clockless high-speed links between line cards or between line cards and switch fabrics using the device’s multi-channel SERDES.
- Board-Level High‑Speed Data Transfer Facilitate proprietary or non-SONET high-speed data transfers across a PCB or backplane leveraging the built-in transceivers and programmable logic.
- Network Termination and Protocol Bridging Terminate backplane links and implement protocol/access logic such as framers or Packet-over-SONET (PoS) interfaces within the programmable fabric.
Unique Advantages
- Integrated High‑Speed PHY and FPGA: Four 0.6–2.7 Gbps SERDES channels with CDR integrated alongside programmable logic reduce need for separate transceiver ICs while enabling high aggregate bandwidth.
- SONET‑Ready Processing: On-chip SONET features (scrambling, framing, limited TOH handling) simplify implementation of SONET/SDH interfaces without requiring external protocol processors.
- Scalable Logic Capacity: 10,368 logic elements and up to 643,000 system gates provide headroom for protocol stacks, custom datapaths and buffering logic.
- Dense I/O and Compact Package: 204 user I/Os in a 484‑BBGA (23×23 mm) package supports dense interconnect requirements in space-constrained board designs.
- Flexible Supply Range: Broad voltage support from 1.425 V to 3.6 V helps integration with various board power domains.
- Commercial Temperature Operation: Specified for 0 °C to 70 °C, suitable for standard commercial applications and environments.
Why Choose ORSO42G5-2BM484C?
The ORSO42G5-2BM484C positions itself as a configurable, high-speed FPGA solution for designers building SONET/SDH backplane interfaces and high-bandwidth board-level links. Its combination of integrated SERDES with CDR, substantial programmable logic (10,368 logic elements), and embedded memory (approximately 113,664 bits) provides a compact platform for implementing protocol termination, framing and custom packet handling functions.
Engineers can leverage the ORCA Series 4 architecture and available development resources to prototype and deploy backplane transceiver functions with a single device that balances I/O density, transceiver performance and programmable logic capacity for commercial applications.
Request a quote or submit an inquiry to purchase ORSO42G5-2BM484C and evaluate its fit for your high-speed backplane and network interface designs.

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