ORSO42G5-1BM484C

IC FPGA 204 I/O 484FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA

Quantity 894 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
DatasheetN/A

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O204Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORSO42G5-1BM484C – ORCA® 4-Channel FPGA, 204 I/O, 10,368 Logic Elements, 484-BBGA

The ORSO42G5-1BM484C is an ORCA® Series 4 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, designed for high-speed backplane and interdevice interfaces. Built on the Series 4 reconfigurable embedded SoC architecture, this device combines programmable FPGA fabric with integrated high-speed serial transceivers to address demanding SONET/SDH and non-SONET backplane applications.

This commercial-grade, surface-mount 484-BBGA package delivers a compact, high-density solution with 204 I/O pins, a wide supply voltage window, and on-chip embedded memory—making it suitable for designers implementing multi-gigabit backplane links, network termination, and high-throughput interconnects.

Key Features

  • Series 4 Reconfigurable SoC Architecture  Integrates FPGA fabric with embedded system features to support complex protocol and interface logic.
  • High-Speed SERDES  Four integrated SERDES channels supporting 0.6–2.7 Gbps per channel with built-in Clock and Data Recovery (CDR) for clockless high-speed links and simplified backplane clocking.
  • Logic Capacity  Approximately 10,368 logic elements available in the FPGA fabric, delivered by 1,296 PFUs for flexible logic implementation.
  • Embedded Memory  Approximately 113,664 bits of on-chip RAM to support buffering, packet processing and protocol logic.
  • High I/O Count  204 user I/O pins for extensive connectivity to system logic, peripherals and backplane interfaces.
  • System Gates  Up to 643,000 system gates for implementing complex data-paths, protocol stacks and custom logic.
  • Package and Mounting  484-BBGA (484-FPBGA, 23×23 mm) surface-mount package for high-density board designs.
  • Power and Temperature  Wide supply range from 1.425 V to 3.6 V and commercial operating temperature 0 °C to 70 °C for standard electronic environments.
  • Compliance  RoHS compliant.

Typical Applications

  • SONET/SDH Backplane Interfaces: Implement STS/STM framing, scrambling/descrambling and transport interfacing using the integrated SERDES and programmable logic.
  • High-Speed Backplane Links: Provide multi-gigabit interboard or backplane connections with clock recovery to reduce backplane routing complexity.
  • Network Termination and Line Cards: Terminate high-speed network links and bridge line cards to switch fabrics with aggregated bandwidth support.
  • 10 Gbps Backplane Connections: Build high-throughput connections between line cards and switch fabric leveraging multiple SERDES channels and FPGA processing.

Unique Advantages

  • Integrated High-Speed Transceivers: Four 0.6–2.7 Gbps SERDES channels with built-in CDR reduce external component count and simplify multi-gigabit link design.
  • Compact, High-Density Package: 484-BBGA (23×23 mm) package packs 204 I/Os and significant logic capacity into a space-efficient footprint for dense board layouts.
  • Flexible Power Envelope: Broad supply voltage support from 1.425 V to 3.6 V enables integration into diverse system power architectures.
  • Significant Logic and Memory Resources: 10,368 logic elements and approximately 113.7 Kbits of embedded memory allow implementation of protocol stacks, buffering and custom processing on-chip.
  • Commercial-Grade Reliability: Specified for 0 °C to 70 °C operation and RoHS compliance for standard commercial electronic applications.

Why Choose ORSO42G5-1BM484C?

The ORSO42G5-1BM484C balances integrated high-speed serial capability with a programmable FPGA fabric to streamline the design of backplane and interboard interfaces. Its combination of four SERDES channels with CDR, more than 10k logic elements, substantial embedded memory, and a high I/O count makes it a practical choice for network equipment, line cards and high-throughput interconnects where on-chip protocol handling and reduced external components matter.

Targeted at engineers and system designers building SONET/SDH and other multi-gigabit backplane solutions, this device offers scalability through programmable logic, a compact 484-BBGA footprint, and the ecosystem benefits of the ORCA Series 4 architecture.

Request a quote or submit an inquiry to receive pricing and availability for the ORSO42G5-1BM484C and to discuss how it fits your next high-speed backplane or interconnect design.

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