ORSO42G5-1BM484C
| Part Description |
ORCA® 4 Field Programmable Gate Array (FPGA) IC 204 113664 10368 484-BBGA |
|---|---|
| Quantity | 894 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet | N/A |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 204 | Voltage | 1.425 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 10368 | ||
| Number of Gates | 643000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of ORSO42G5-1BM484C – ORCA® 4-Channel FPGA, 204 I/O, 10,368 Logic Elements, 484-BBGA
The ORSO42G5-1BM484C is an ORCA® Series 4 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, designed for high-speed backplane and interdevice interfaces. Built on the Series 4 reconfigurable embedded SoC architecture, this device combines programmable FPGA fabric with integrated high-speed serial transceivers to address demanding SONET/SDH and non-SONET backplane applications.
This commercial-grade, surface-mount 484-BBGA package delivers a compact, high-density solution with 204 I/O pins, a wide supply voltage window, and on-chip embedded memory—making it suitable for designers implementing multi-gigabit backplane links, network termination, and high-throughput interconnects.
Key Features
- Series 4 Reconfigurable SoC Architecture Integrates FPGA fabric with embedded system features to support complex protocol and interface logic.
- High-Speed SERDES Four integrated SERDES channels supporting 0.6–2.7 Gbps per channel with built-in Clock and Data Recovery (CDR) for clockless high-speed links and simplified backplane clocking.
- Logic Capacity Approximately 10,368 logic elements available in the FPGA fabric, delivered by 1,296 PFUs for flexible logic implementation.
- Embedded Memory Approximately 113,664 bits of on-chip RAM to support buffering, packet processing and protocol logic.
- High I/O Count 204 user I/O pins for extensive connectivity to system logic, peripherals and backplane interfaces.
- System Gates Up to 643,000 system gates for implementing complex data-paths, protocol stacks and custom logic.
- Package and Mounting 484-BBGA (484-FPBGA, 23×23 mm) surface-mount package for high-density board designs.
- Power and Temperature Wide supply range from 1.425 V to 3.6 V and commercial operating temperature 0 °C to 70 °C for standard electronic environments.
- Compliance RoHS compliant.
Typical Applications
- SONET/SDH Backplane Interfaces: Implement STS/STM framing, scrambling/descrambling and transport interfacing using the integrated SERDES and programmable logic.
- High-Speed Backplane Links: Provide multi-gigabit interboard or backplane connections with clock recovery to reduce backplane routing complexity.
- Network Termination and Line Cards: Terminate high-speed network links and bridge line cards to switch fabrics with aggregated bandwidth support.
- 10 Gbps Backplane Connections: Build high-throughput connections between line cards and switch fabric leveraging multiple SERDES channels and FPGA processing.
Unique Advantages
- Integrated High-Speed Transceivers: Four 0.6–2.7 Gbps SERDES channels with built-in CDR reduce external component count and simplify multi-gigabit link design.
- Compact, High-Density Package: 484-BBGA (23×23 mm) package packs 204 I/Os and significant logic capacity into a space-efficient footprint for dense board layouts.
- Flexible Power Envelope: Broad supply voltage support from 1.425 V to 3.6 V enables integration into diverse system power architectures.
- Significant Logic and Memory Resources: 10,368 logic elements and approximately 113.7 Kbits of embedded memory allow implementation of protocol stacks, buffering and custom processing on-chip.
- Commercial-Grade Reliability: Specified for 0 °C to 70 °C operation and RoHS compliance for standard commercial electronic applications.
Why Choose ORSO42G5-1BM484C?
The ORSO42G5-1BM484C balances integrated high-speed serial capability with a programmable FPGA fabric to streamline the design of backplane and interboard interfaces. Its combination of four SERDES channels with CDR, more than 10k logic elements, substantial embedded memory, and a high I/O count makes it a practical choice for network equipment, line cards and high-throughput interconnects where on-chip protocol handling and reduced external components matter.
Targeted at engineers and system designers building SONET/SDH and other multi-gigabit backplane solutions, this device offers scalability through programmable logic, a compact 484-BBGA footprint, and the ecosystem benefits of the ORCA Series 4 architecture.
Request a quote or submit an inquiry to receive pricing and availability for the ORSO42G5-1BM484C and to discuss how it fits your next high-speed backplane or interconnect design.