OR4E06-2BM680C

The OR4E06-2BM680C is a commercial-grade ORCA™4 field programmable gate array (FPGA) in a 680-BBGA package. It delivers a balanced mix of programmable logic, embedded memory, and high I/O density for commercial embedded designs that require flexible, reconfigurable digital logic.

Key Features

• Programmable Logic Approximately 16,192 logic elements provide the core programmable resources for implementing custom digital functions and state machines.
• Embedded Memory Approximately 0.152 Mbits (151,552 bits) of on-chip RAM to support buffering, state storage, and small-footprint data tables.
• I/O Capacity 466 user I/O pins enable high pin-count interfacing for parallel buses, multiple peripherals, and mixed-signal front-end connections.
• Gate Equivalent Equivalent to 899,000 gates of logic, useful for estimating integration density and partitioning designs.
• Power and Supply Operates from a core supply range of 1.425 V to 1.575 V, allowing precise power budgeting for the core power rail.
• Package and Mounting 680-PBGAM (35 × 35 mm) package, surface-mount mounting type, suitable for compact PCB layouts requiring a high-pin-count BGA.
• Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 70 °C and RoHS compliance for standard commercial environments.

Typical Applications

• Custom digital logic and glue logic — Implement application-specific controllers, protocol bridging, and timing-critical glue logic inside a single FPGA.
• Prototyping and development — Use the device for hardware prototyping where reconfigurability and moderate logic capacity are required.
• I/O expansion and interfacing — Leverage 466 I/Os to connect multiple peripherals, sensors, and external memory buses in dense designs.

Unique Advantages

• High logic density: Approximately 16,192 logic elements and 899,000 gate equivalents let you consolidate multiple discrete functions into one device, reducing board complexity.
• Substantial I/O count: 466 I/Os support complex, high-pin-count interfaces without needing additional I/O expanders.
• Embedded RAM for local storage: Approximately 0.152 Mbits of on-chip RAM enables efficient local buffering and small data structures without external memory.
• Compact BGA package: The 680‑PBGAM (35 × 35 mm) BGA provides a space-efficient footprint for high-density board designs.
• Commercial operating profile: Designed for 0 °C to 70 °C operation and RoHS compliance to match standard commercial deployment requirements.

Why Choose OR4E06-2BM680C?

The OR4E06-2BM680C positions as a versatile, commercial-grade FPGA option when you need a combination of moderate-to-high logic capacity, extensive I/O, and on-chip memory in a compact BGA package. Its specified core voltage range, surface-mount 680‑BBGA package, and RoHS compliance make it suitable for a wide range of commercial embedded projects that require reconfigurable logic without adding excessive board area or external components.

Choose this part when your design demands consolidated digital functions, numerous peripheral interfaces, and the flexibility to iterate hardware logic during development or product updates.

Request a quote or contact sales to discuss pricing, availability, and lead times for OR4E06-2BM680C.