ORLI10G-2BM680C

FPGA, PBGA680
Part Description

ORCA® ORLI10G Field Programmable Gate Array (FPGA) IC 316 113664 10368 680-BBGA

Quantity 1,710 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package680-PBGAM (35x35)GradeCommercialOperating Temperature-40°C – 125°C
Package / Case680-BBGANumber of I/O316Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORLI10G-2BM680C – ORCA® ORLI10G Field Programmable Gate Array (FPGA) IC, 680-BBGA

The ORLI10G-2BM680C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation that delivers mid-range programmable logic capacity and system connectivity in a 680-ball BGA package. It provides a balance of logic resources, embedded memory, and a high I/O count for designs that require substantial on-chip integration within a commercial-grade FPGA.

Key device characteristics include 10,368 logic elements, approximately 113,664 bits of on-chip RAM, 316 user I/O pins, a 3.0–3.6 V supply range, and a specified operating temperature range of −40 °C to 125 °C.

Key Features

  • Core / Logic Density 10,368 logic elements and approximately 643,000 gates provide significant programmable logic capacity for mid-range designs.
  • Embedded Memory Approximately 0.114 Mbits (113,664 bits) of on-chip RAM for buffering, FIFOs, and local storage.
  • I/O 316 user I/O pins to support multiple peripherals and interface requirements.
  • Package & Mounting 680-BBGA (supplier package 680-PBGAM) in a 35 × 35 mm footprint, surface-mount mounting type for PCB assembly.
  • Power Voltage supply range from 3.0 V to 3.6 V to match common system rails.
  • Temperature & Grade Commercial grade device specified for operation from −40 °C to 125 °C.
  • Environmental RoHS compliant.

Unique Advantages

  • Significant logic capacity: 10,368 logic elements and ~643k gates enable implementation of complex combinational and sequential logic without external ASICs.
  • On-chip memory: Approximately 0.114 Mbits of embedded RAM reduces reliance on external memory for buffering and state retention.
  • High I/O count: 316 user I/O pins provide flexibility for multi-channel interfaces and dense system integration.
  • Compact, high-pin-count package: 680-ball BBGA (35 × 35 mm) delivers high connectivity in a surface-mount footprint suitable for modern PCB layouts.
  • Flexible power options: 3.0–3.6 V supply range aligns with standard digital power rails for straightforward system integration.
  • Regulatory readiness: RoHS compliance supports environmental requirements for commercial products.

Why Choose ORLI10G-2BM680C?

The ORLI10G-2BM680C positions itself as a commercial-grade FPGA option that balances logic density, embedded memory, and a large I/O complement in a compact BGA package. It is suitable for engineers and system designers who need mid-range programmable logic capacity with broad connectivity and on-chip resources in a surface-mount form factor.

Manufactured by Lattice Semiconductor Corporation, this device delivers a combination of features that support scalable design choices and integration across a variety of commercial embedded applications where on-chip memory, I/O density, and a defined operating temperature window are important selection criteria.

Request a quote or submit a pricing and availability inquiry for the ORLI10G-2BM680C to receive current lead-time and ordering information.

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