ORLI10G-1BM680C

FPGA, PBGA680
Part Description

ORCA® ORLI10G Field Programmable Gate Array (FPGA) IC 316 113664 10368 680-BBGA

Quantity 1,086 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package680-PBGAM (35x35)GradeCommercialOperating Temperature-40°C – 125°C
Package / Case680-BBGANumber of I/O316Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORLI10G-1BM680C – ORCA® ORLI10G Field Programmable Gate Array (FPGA), 316 I/O, 10,368 Logic Elements, 680-BBGA

The ORLI10G-1BM680C is a commercial-grade ORCA® ORLI10G field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It integrates 10,368 logic elements with approximately 113,664 bits (≈0.114 Mbits) of on-chip RAM and up to 316 I/O signals in a compact 680-ball BBGA package.

Designed for commercial embedded and communications applications, the device delivers a combination of logic density, a large I/O count, and a surface-mount 35×35 mm package suitable for space-constrained board designs. Electrical operation is supported from 3.0 V to 3.6 V with an operating temperature range of −40°C to 125°C.

Key Features

  • Logic Capacity  10,368 logic elements provide programmable fabric for implementing complex combinational and sequential logic functions.
  • Embedded Memory  Approximately 113,664 bits of on-chip RAM (≈0.114 Mbits) for buffering, state storage, and small data tables.
  • I/O Density  Up to 316 I/O pins to support multiple parallel interfaces, sensor arrays, or front-end connectivity.
  • Gate Equivalent  Approximately 643,000 gates of logic equivalency to help quantify system-level capacity and integration.
  • Package & Mounting  680-BBGA (supplier package 680-PBGAM, 35×35 mm) in a surface-mount form factor for high-density PCB designs.
  • Power  Supported voltage supply range from 3.0 V to 3.6 V for standard commercial system rails.
  • Temperature Range  Rated for operation from −40°C to 125°C to accommodate a broad set of commercial operating environments.
  • Environmental Compliance  RoHS compliant to meet common regulatory and manufacturing requirements.

Typical Applications

  • Embedded Systems  Implement control logic, protocol bridging, and peripheral management where moderate logic density and extensive I/O are required.
  • Communications Equipment  Enable custom packet processing, interface conversion, or timing functions leveraging the device’s logic capacity and I/O count.
  • Consumer Electronics  Handle display controllers, audio/video pre-processing, or feature integration in compact, surface-mount designs.
  • Prototyping and Development  Provide a commercial FPGA platform for evaluating logic architectures and validating system-level designs prior to production.

Unique Advantages

  • High Logic Density: 10,368 logic elements give designers ample programmable resources for mid-range integration without moving to larger families.
  • Large I/O Count: Up to 316 I/O pins simplify board-level routing for multi-channel interfaces and parallel connectivity.
  • Compact BBGA Packaging: 680-ball BBGA (35×35 mm) balances pin count and PCB real estate for dense, surface-mount implementations.
  • Wide Operating Voltage: 3.0 V to 3.6 V support compatibility with common commercial system supply rails.
  • Broad Temperature Range: Rated operation from −40°C to 125°C to cover a wide span of commercial deployment conditions.
  • Regulatory Compliance: RoHS compliance supports environmentally responsible manufacturing and assembly processes.

Why Choose ORLI10G-1BM680C?

The ORLI10G-1BM680C positions itself as a versatile commercial FPGA for designers who need substantial logic resources, a high I/O count, and a compact surface-mount package. Its combination of 10,368 logic elements, approximately 0.114 Mbits of embedded RAM, and 316 I/O pins makes it suitable for a wide range of commercial embedded and communications applications where on-board integration and I/O flexibility matter.

Backed by Lattice Semiconductor Corporation’s product documentation, this device offers a predictable platform for system-level integration, enabling scalable designs and straightforward board-level implementation with standard 3.0–3.6 V supplies and RoHS-compliant assembly.

Request a quote or submit a product inquiry to receive pricing, availability, and delivery information for the ORLI10G-1BM680C. Our team can assist with ordering and provide the manufacturer’s datasheet for detailed electrical and timing specifications.

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