OR4E04-1BA352I
| Part Description |
ORCA™4 Field Programmable Gate Array (FPGA) IC 262 113664 10368 352-BBGA |
|---|---|
| Quantity | 1,064 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-PBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BBGA | Number of I/O | 262 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 10368 | ||
| Number of Gates | 643000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of OR4E04-1BA352I – ORCA™4 Field Programmable Gate Array (FPGA), 352-BBGA
The OR4E04-1BA352I is an ORCA™4 family FPGA from Lattice Semiconductor Corporation, configured in a 352-BBGA package. It delivers a balance of programmable logic, on‑chip memory, and a high I/O count for industrial applications that require reconfigurable hardware implemented in a compact surface-mount form factor.
Key platform characteristics include 10,368 logic elements, approximately 0.114 Mbits of embedded memory, 262 user I/O, and operation across an extended industrial temperature range with a tightly defined core supply window.
Key Features
- Core Logic 10,368 logic elements organized across 1,296 logic array blocks to implement custom digital logic and state machines.
- Embedded Memory Approximately 0.114 Mbits of on‑chip RAM suitable for buffering, small FIFOs, and local state storage.
- I/O Capacity 262 user I/O pins to support multiple external interfaces and parallel/serial connectivity options within a single device.
- Package 352‑BBGA package; supplier device package listed as 352‑PBGA (35×35) for a compact, high‑density board footprint and surface‑mount assembly.
- Power Core supply voltage range of 1.425 V to 1.575 V, enabling defined power design and supply sequencing.
- Industrial Temperature Range Rated for operation from −40 °C to 85 °C to meet environmental needs of industrial deployments.
- Environmental Compliance RoHS‑compliant to support environmentally conscious manufacturing and regulatory requirements.
Typical Applications
- Industrial control and automation Use the device where reconfigurable logic and reliable operation from −40 °C to 85 °C are required for control, monitoring, and sequencing functions.
- I/O‑dense interface bridging Implement custom interface logic and protocol translation with access to 262 user I/O pins for connecting sensors, actuators, and peripherals.
- Embedded logic and buffering Deploy the on‑chip memory (approximately 0.114 Mbits) and 10,368 logic elements to implement local buffering, finite state machines, and application‑specific peripherals.
Unique Advantages
- High logic capacity: 10,368 logic elements provide substantial resources for mid‑range FPGA designs without moving to larger packages.
- Generous I/O count: 262 user I/O pins enable consolidation of multiple interface functions into a single device, reducing board complexity.
- Compact, high-density package: 352‑BBGA / 352‑PBGA (35×35) minimizes PCB area while supporting surface‑mount assembly.
- Industrial operating range: Rated from −40 °C to 85 °C to support deployment in a wide range of industrial environments.
- Defined core supply window: 1.425 V to 1.575 V core voltage simplifies power-supply design and margin planning.
- RoHS compliant: Designed to meet common environmental regulations for modern electronics production.
Why Choose OR4E04-1BA352I?
The OR4E04-1BA352I positions itself as a capable industrial-grade FPGA option by combining 10,368 logic elements, a substantial I/O count, and on‑chip memory in a compact 352‑BBGA package. These characteristics make it suitable for designers seeking to implement medium-complexity programmable logic and interface consolidation within temperature‑sensitive industrial applications.
Backed by Lattice Semiconductor Corporation, this part delivers clear, verifiable specifications for logic capacity, memory, I/O, package, supply voltage, and operating temperature—helping engineering and procurement teams specify hardware with predictable electrical and environmental parameters.
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Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016