OR4E02-1BM416C

The OR4E02-1BM416C is an ORCA™4 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a balance of logic capacity, on-chip memory and I/O density for embedded digital designs.

With 4,992 logic elements, approximately 0.076 Mbits of embedded memory, and 290 user I/Os in a 416-BBGA package, this commercial-grade FPGA suits applications that require moderate logic integration, substantial I/O count and surface-mount packaging.

Key Features

• Core Logic — 4,992 logic elements (CLBs) providing programmable logic resources for custom digital functions.
• Embedded Memory — Approximately 0.076 Mbits of on-chip RAM (75,776 bits) to support buffering, state storage and small lookup tables.
• I/O Density — 290 user I/O pins to support parallel interfaces, multiple peripherals or mixed-signal front-ends via external devices.
• Gate Count — 397,000 gates representing overall device complexity and integration capability.
• Power — Core supply range of 1.425 V to 1.575 V for the FPGA core rails.
• Package & Mounting — 416-BBGA (supplier device package: 416-PBGAM, 35 × 35 mm) in a surface-mount format for compact PCB integration.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 70 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density I/O systems — Use the 290 user I/Os for interface aggregation, protocol bridging or parallel sensor arrays.
• Embedded control and glue logic — Deploy the 4,992 logic elements to implement state machines, timing control and custom peripheral logic.
• On-board buffering and small memory functions — Leverage approximately 0.076 Mbits of embedded RAM for FIFOs, small buffers and lookup tables.

Unique Advantages

• Balanced logic and memory resources: 4,992 logic elements paired with 75,776 bits of RAM give designers flexibility for mixed logic-and-memory functions.
• High I/O count: 290 user I/Os allow integration of multiple external interfaces without additional I/O expanders.
• Compact surface-mount packaging: 416-BBGA (35 × 35 mm) enables high-density board implementations while maintaining robust pin count.
• Commercial temperature rating: Specified 0 °C to 70 °C operation supports a wide range of customer electronics and industrial-adjacent applications where commercial grading is appropriate.
• RoHS compliant: Conforms to lead-free manufacturing and assembly requirements.

Why Choose OR4E02-1BM416C?

The OR4E02-1BM416C positions itself as a practical, mid-capacity FPGA combining nearly 5k logic elements, substantial I/O availability and embedded RAM in a compact 416-BBGA surface-mount package. It is well suited for designers who need to consolidate glue logic, interface management and modest buffering on a single programmable device.

This device is a fit for projects that prioritize I/O density and programmable logic integration within commercial temperature and power ranges, offering predictable specifications and RoHS compliance for volume manufacturing and assembly.

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