OR3TP127BA352-DB

The OR3TP127BA352-DB is a commercial-grade ORCA™ OR3TP12 Field Programmable Gate Array (FPGA) in a 352-BBGA package. It integrates 2016 logic elements and approximately 32 Kbits of on-chip RAM, providing a compact, reconfigurable logic fabric for commercial embedded designs that require a moderate logic capacity and a high I/O count.

With 187 user I/Os, support for 3.0 V to 3.6 V supply voltages, and surface-mount packaging, this FPGA is targeted at designers needing flexible digital logic, interfacing density, and predictable thermal/voltage operating bounds for commercial-temperature applications.

Key Features

• Core Logic  2016 logic elements supporting up to 60,000 gates for implementing custom digital functions and glue logic.
• Embedded Memory  Approximately 32 Kbits of on-chip RAM for small buffering, state storage, and lookup tables.
• I/O Density & Package  187 I/Os in a 352-BBGA package (supplier package: 352-PBGA 35×35) to support substantial external interfacing in a compact footprint.
• Power  Operates from a 3.0 V to 3.6 V supply range, suitable for common commercial power domains.
• Mounting & Package Type  Surface mount device in a 352-BBGA package for PCB assembly and board-level integration.
• Operating Conditions  Commercial temperature grade with a specified operating range of 0 °C to 70 °C.

Typical Applications

• Custom digital control  Implement application-specific logic, protocol handling, or control state machines using the device's 2016 logic elements and embedded RAM.
• High-density I/O interfacing  Use the 187 I/Os to aggregate signals from sensors, peripherals, or external logic while maintaining a compact board footprint.
• Prototyping and low- to mid-complexity systems  Deploy the FPGA for iterative development of commercial embedded products where moderate logic capacity and on-chip memory are sufficient.

Unique Advantages

• Balanced logic capacity: 2016 logic elements and 60,000 gates provide a mid-range programmable fabric suitable for many control and glue-logic tasks without excess overhead.
• On-chip memory for local storage: Approximately 32 Kbits of embedded RAM enables local buffering and state retention without immediate need for external memory.
• High I/O count in a compact package: 187 I/Os in a 352-BBGA package deliver dense interfacing capability while conserving PCB area.
• Commercial temperature operation: Specified 0 °C to 70 °C range matches typical commercial product requirements.
• Standard supply domain: 3.0 V to 3.6 V operation aligns with common commercial power rails, simplifying power-supply design.
• Surface-mount assembly: 352-BBGA surface-mount package supports standard automated PCB assembly processes.

Why Choose OR3TP127BA352-DB?

The OR3TP127BA352-DB positions itself as a compact, commercially graded FPGA option that balances logic capacity, embedded memory, and a high I/O count in a 352-BBGA package. Its specifications make it well suited for commercial embedded designs where moderate programmable logic, on-chip RAM, and dense external interfacing are required within standard operating temperature and voltage ranges.

For development teams and procurement departments seeking a reconfigurable device with clear, verifiable specifications—2016 logic elements, ~32 Kbits RAM, 187 I/Os, and 3.0 V–3.6 V operation—the OR3TP127BA352-DB offers a predictable platform for custom logic, interface aggregation, and iterative product development.

Request a quote or submit a pricing inquiry to obtain availability and lead-time details for the OR3TP127BA352-DB.