OR3T807PS208-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 171 63488 3872 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 435 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP2 (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 484 | Number of Logic Elements/Cells | 3872 | ||
| Number of Gates | 116000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 63488 |
Overview of OR3T807PS208-DB – ORCA™3C Field Programmable Gate Array (FPGA), 171 I/O, 208‑BFQFP
The OR3T807PS208-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation providing a mid-density, commercial-grade programmable logic solution. It integrates 3,872 logic elements, approximately 0.06 Mbits of embedded RAM, and 171 user I/O on a single surface-mount package, making it suitable for I/O‑intensive and general-purpose digital designs.
Designed for commercial applications requiring a 3.0 V to 3.6 V supply and standard temperature operation, this device balances logic capacity, on-chip memory, and I/O count to support a wide range of embedded functions and custom digital implementations.
Key Features
- Core Logic 3,872 logic elements and 484 CLBs provide mid-density programmable logic resources for implementing custom digital functions and state machines.
- Embedded Memory Total on-chip RAM of 63,488 bits (approximately 0.06 Mbits) supports buffering, lookup tables, and small data structures without external memory.
- I/O Capacity 171 general-purpose I/O pins accommodate high pin-count interfaces and parallel connections for sensors, peripherals, and external controllers.
- Gate Equivalent Approximately 116,000 gates, enabling implementation of moderately complex logic and glue functions within a single FPGA.
- Power and Supply Operates from a 3.0 V to 3.6 V supply range to match common commercial logic domains.
- Package and Mounting 208‑lead BFQFP with exposed pad (supplier package: 208‑SQFP2, 28 × 28 mm) in a surface-mount format for compact board-level integration and thermal path through the exposed pad.
- Commercial Temperature Range Rated for 0 °C to 70 °C operation for standard commercial applications.
- RoHS Compliant Meets RoHS requirements for lead-free assembly.
Typical Applications
- Commercial Embedded Systems Implements custom control logic, protocol bridging, and timing-critical functions where mid-density logic and plentiful I/O are required.
- Communications and Interfaces Serves as an I/O concentrator or interface translator for systems that need many parallel or serial connections at the board level.
- Prototyping and Evaluation Provides a compact, surface-mount FPGA option for development platforms and FPGA-based evaluation modules in commercial environments.
- Peripheral and Glue Logic Replaces discrete logic for glue, bus arbitration, and simple data-path tasks to reduce BOM and board area.
Unique Advantages
- Balanced Logic and I/O: Combines 3,872 logic elements with 171 I/O pins to support designs that need both moderate logic capacity and high pin count.
- On-chip Memory for Local Data: Approximately 0.06 Mbits of embedded RAM enables local buffering and LUT-based functions without external memory.
- Compact Surface-Mount Package: 208‑BFQFP with exposed pad offers a space-efficient footprint and a thermal path for reliable board-level mounting.
- Commercial Supply Range: 3.0 V to 3.6 V operation aligns with common commercial logic domains for straightforward power system integration.
- Known Manufacturer: Produced by Lattice Semiconductor Corporation, the device is offered within an established FPGA product family for predictable sourcing.
Why Choose OR3T807PS208-DB?
The OR3T807PS208-DB positions itself as a practical, mid-density FPGA choice for commercial projects that require a blend of logic capacity, on-chip memory, and substantial I/O. Its 208‑lead BFQFP package and surface-mount mounting style enable compact board layouts while the exposed pad supports thermal management at the PCB level.
This device is well suited for engineers building commercial embedded systems, interface bridging solutions, or prototype platforms who need reliable, verifiable FPGA resources from Lattice Semiconductor Corporation and a straightforward 3.0–3.6 V power domain.
Request a quote or submit a pricing and availability inquiry to receive lead-time and purchasing information for the OR3T807PS208-DB.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016