OR3T807PS208-DB

FPGA, 484 CLBS, 116000 GATES
Part Description

ORCA™3C Field Programmable Gate Array (FPGA) IC 171 63488 3872 208-BFQFP Exposed Pad

Quantity 435 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-SQFP2 (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs484Number of Logic Elements/Cells3872
Number of Gates116000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits63488

Overview of OR3T807PS208-DB – ORCA™3C Field Programmable Gate Array (FPGA), 171 I/O, 208‑BFQFP

The OR3T807PS208-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation providing a mid-density, commercial-grade programmable logic solution. It integrates 3,872 logic elements, approximately 0.06 Mbits of embedded RAM, and 171 user I/O on a single surface-mount package, making it suitable for I/O‑intensive and general-purpose digital designs.

Designed for commercial applications requiring a 3.0 V to 3.6 V supply and standard temperature operation, this device balances logic capacity, on-chip memory, and I/O count to support a wide range of embedded functions and custom digital implementations.

Key Features

  • Core Logic  3,872 logic elements and 484 CLBs provide mid-density programmable logic resources for implementing custom digital functions and state machines.
  • Embedded Memory  Total on-chip RAM of 63,488 bits (approximately 0.06 Mbits) supports buffering, lookup tables, and small data structures without external memory.
  • I/O Capacity  171 general-purpose I/O pins accommodate high pin-count interfaces and parallel connections for sensors, peripherals, and external controllers.
  • Gate Equivalent  Approximately 116,000 gates, enabling implementation of moderately complex logic and glue functions within a single FPGA.
  • Power and Supply  Operates from a 3.0 V to 3.6 V supply range to match common commercial logic domains.
  • Package and Mounting  208‑lead BFQFP with exposed pad (supplier package: 208‑SQFP2, 28 × 28 mm) in a surface-mount format for compact board-level integration and thermal path through the exposed pad.
  • Commercial Temperature Range  Rated for 0 °C to 70 °C operation for standard commercial applications.
  • RoHS Compliant  Meets RoHS requirements for lead-free assembly.

Typical Applications

  • Commercial Embedded Systems  Implements custom control logic, protocol bridging, and timing-critical functions where mid-density logic and plentiful I/O are required.
  • Communications and Interfaces  Serves as an I/O concentrator or interface translator for systems that need many parallel or serial connections at the board level.
  • Prototyping and Evaluation  Provides a compact, surface-mount FPGA option for development platforms and FPGA-based evaluation modules in commercial environments.
  • Peripheral and Glue Logic  Replaces discrete logic for glue, bus arbitration, and simple data-path tasks to reduce BOM and board area.

Unique Advantages

  • Balanced Logic and I/O: Combines 3,872 logic elements with 171 I/O pins to support designs that need both moderate logic capacity and high pin count.
  • On-chip Memory for Local Data: Approximately 0.06 Mbits of embedded RAM enables local buffering and LUT-based functions without external memory.
  • Compact Surface-Mount Package: 208‑BFQFP with exposed pad offers a space-efficient footprint and a thermal path for reliable board-level mounting.
  • Commercial Supply Range: 3.0 V to 3.6 V operation aligns with common commercial logic domains for straightforward power system integration.
  • Known Manufacturer: Produced by Lattice Semiconductor Corporation, the device is offered within an established FPGA product family for predictable sourcing.

Why Choose OR3T807PS208-DB?

The OR3T807PS208-DB positions itself as a practical, mid-density FPGA choice for commercial projects that require a blend of logic capacity, on-chip memory, and substantial I/O. Its 208‑lead BFQFP package and surface-mount mounting style enable compact board layouts while the exposed pad supports thermal management at the PCB level.

This device is well suited for engineers building commercial embedded systems, interface bridging solutions, or prototype platforms who need reliable, verifiable FPGA resources from Lattice Semiconductor Corporation and a straightforward 3.0–3.6 V power domain.

Request a quote or submit a pricing and availability inquiry to receive lead-time and purchasing information for the OR3T807PS208-DB.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up