OR3T807BA352-DB

The OR3T807BA352-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-range configurable logic fabric with 3,872 logic elements and extensive I/O capability in a compact 352-BBGA package.

Designed for commercial-temperature applications, the device operates from a 3 V to 3.6 V supply and is RoHS compliant, making it suitable for surface-mount designs that require moderate logic density, significant on-chip memory, and a large number of I/O pins.

Key Features

• Logic Capacity 3,872 logic elements (LEs) to implement custom combinational and sequential logic functions.
• Embedded Memory Approximately 0.063 Mbits of embedded RAM (63,488 bits) for data buffering, state storage, and small lookup tables.
• I/O Resources 298 user I/O pins to support extensive external peripheral and bus interfacing directly from the FPGA.
• Gate Equivalent 116,000 gate equivalents provide a practical measure of device complexity for system partitioning and comparison.
• Power and Temperature Single-supply operation from 3 V to 3.6 V with a commercial operating temperature range of 0 °C to 70 °C.
• Package and Mounting Surface-mount 352-BBGA package (supplier device package: 352-PBGA, 35×35 mm) for compact PCB implementations.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Embedded control — Implement mid-range control logic and glue functions where several hundred I/Os and thousands of logic elements are required.
• Interface aggregation — Consolidate multiple peripheral interfaces into a single programmable device using the device’s high I/O count.
• Prototyping and evaluation — Validate algorithms and system-level logic in hardware with a compact FPGA offering a balance of logic, memory, and I/O.

Unique Advantages

• Balanced logic and memory mix — 3,872 logic elements paired with approximately 0.063 Mbits of embedded RAM enables a range of mid-complexity designs without external memory for small data sets.
• High I/O density — 298 I/O pins allow direct connection to many peripherals and buses, reducing the need for additional interface components.
• Compact PBGA footprint — 352-BBGA (35×35 mm) package delivers a compact footprint for space-constrained PCBs while maintaining routing density.
• Commercial temperature suitability — Rated for 0 °C to 70 °C operation to meet a wide range of standard electronic product requirements.
• RoHS compliance — Supports environmentally conscious manufacturing and regulatory needs.

Why Choose OR3T807BA352-DB?

The OR3T807BA352-DB positions itself as a practical programmable logic option for designs that need a mid-range count of logic elements, substantial I/O capacity, and on-chip RAM in a compact PBGA package. Its electrical and thermal ratings align with commercial electronic products that run from a 3 V to 3.6 V supply and operate within 0 °C to 70 °C.

This device is well suited for engineers and teams developing embedded control, interface consolidation, or hardware prototypes that require a balance of integration and board-level simplicity while maintaining RoHS compliance.

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