OR3T806S208-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 171 63488 3872 208-BFQFP |
|---|---|
| Quantity | 374 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 484 | Number of Logic Elements/Cells | 3872 | ||
| Number of Gates | 116000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 63488 |
Overview of OR3T806S208-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC 171 I/O 208-BFQFP
The OR3T806S208-DB is an ORCA™3C field programmable gate array (FPGA) designed for commercial embedded applications requiring medium-density logic and flexible I/O. It provides 3,872 logic elements, approximately 0.063 Mbits of embedded memory, and 171 user I/O lines in a 208-pin BFQFP surface-mount package.
With a 3.0 V to 3.6 V supply range and an ambient operating range of 0 °C to 70 °C, this device fits a variety of commercial designs where compact packaging, moderate logic capacity, and high I/O count are key design drivers.
Key Features
- Core and Logic Capacity Provides 3,872 logic elements (LEs) and a gate equivalence of 116,000 gates for implementing glue logic, control functions, and moderate-complexity FPGA tasks.
- Embedded Memory Includes 63,488 bits of on-chip RAM, approximately 0.063 Mbits of embedded memory for small buffers, FIFOs, and state storage.
- I/O Resources 171 user I/O pins support diverse peripheral interfacing and flexible signal routing for mixed-signal front ends and multi-peripheral systems.
- Power Supply Operates from a 3.0 V to 3.6 V supply, compatible with standard 3.3 V digital systems.
- Package and Mounting 208-pin BFQFP surface-mount package (supplier designation 208-SQFP, 28×28 mm) for compact PCB footprint and automated assembly.
- Operating Temperature Commercial temperature range: 0 °C to 70 °C, suitable for office, lab, and indoor commercial environments.
- Regulatory Compliance RoHS compliant for lead-free manufacturing and environmental compliance in commercial products.
Typical Applications
- Consumer Electronics Implement control logic, user-interface management, and peripheral bridging in consumer devices where a balance of logic capacity and I/O density is required.
- Communications Equipment Serve as protocol glue, signal conditioning, and I/O aggregation in commercial-networking and communications hardware.
- Test & Measurement Provide configurable logic and buffering for data acquisition front ends, instrument control, and custom timing functions.
- Embedded Control Systems Handle control sequencing, sensor interfacing, and moderate-complexity state machines in commercial embedded systems.
Unique Advantages
- Balanced Logic-to-I/O Ratio: 3,872 logic elements combined with 171 I/O pins provide designers the flexibility to implement mid-scale logic while supporting many external interfaces.
- Compact Surface-Mount Package: 208-pin BFQFP package enables a dense PCB layout and is compatible with standard surface-mount assembly processes.
- Standard 3.3 V System Compatibility: 3.0 V to 3.6 V supply range aligns with common 3.3 V digital ecosystems, simplifying power-rail integration.
- On-Chip RAM for Local Buffering: Approximately 0.063 Mbits of embedded RAM supports small FIFOs, lookup tables, and temporary data storage without external memory.
- RoHS Compliant: Meets lead-free process requirements for commercial product manufacturing.
Why Choose OR3T806S208-DB?
The OR3T806S208-DB positions itself as a practical, mid-density FPGA option for commercial designs that need a well-rounded mix of logic capacity, embedded memory, and a high I/O count in a compact surface-mount package. It is well suited to engineers implementing control logic, peripheral bridging, and configurable interfaces within standard 3.3 V systems.
Its combination of 3,872 logic elements, 63,488 bits of on-chip RAM, and 171 I/O pins delivers scalable capability for prototype and production designs while RoHS compliance supports contemporary manufacturing requirements.
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