OR3T806S208-DB

FPGA, 484 CLBS, 116000 GATES
Part Description

ORCA™3C Field Programmable Gate Array (FPGA) IC 171 63488 3872 208-BFQFP

Quantity 374 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-SQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs484Number of Logic Elements/Cells3872
Number of Gates116000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits63488

Overview of OR3T806S208-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC 171 I/O 208-BFQFP

The OR3T806S208-DB is an ORCA™3C field programmable gate array (FPGA) designed for commercial embedded applications requiring medium-density logic and flexible I/O. It provides 3,872 logic elements, approximately 0.063 Mbits of embedded memory, and 171 user I/O lines in a 208-pin BFQFP surface-mount package.

With a 3.0 V to 3.6 V supply range and an ambient operating range of 0 °C to 70 °C, this device fits a variety of commercial designs where compact packaging, moderate logic capacity, and high I/O count are key design drivers.

Key Features

  • Core and Logic Capacity  Provides 3,872 logic elements (LEs) and a gate equivalence of 116,000 gates for implementing glue logic, control functions, and moderate-complexity FPGA tasks.
  • Embedded Memory  Includes 63,488 bits of on-chip RAM, approximately 0.063 Mbits of embedded memory for small buffers, FIFOs, and state storage.
  • I/O Resources  171 user I/O pins support diverse peripheral interfacing and flexible signal routing for mixed-signal front ends and multi-peripheral systems.
  • Power Supply  Operates from a 3.0 V to 3.6 V supply, compatible with standard 3.3 V digital systems.
  • Package and Mounting  208-pin BFQFP surface-mount package (supplier designation 208-SQFP, 28×28 mm) for compact PCB footprint and automated assembly.
  • Operating Temperature  Commercial temperature range: 0 °C to 70 °C, suitable for office, lab, and indoor commercial environments.
  • Regulatory Compliance  RoHS compliant for lead-free manufacturing and environmental compliance in commercial products.

Typical Applications

  • Consumer Electronics  Implement control logic, user-interface management, and peripheral bridging in consumer devices where a balance of logic capacity and I/O density is required.
  • Communications Equipment  Serve as protocol glue, signal conditioning, and I/O aggregation in commercial-networking and communications hardware.
  • Test & Measurement  Provide configurable logic and buffering for data acquisition front ends, instrument control, and custom timing functions.
  • Embedded Control Systems  Handle control sequencing, sensor interfacing, and moderate-complexity state machines in commercial embedded systems.

Unique Advantages

  • Balanced Logic-to-I/O Ratio:  3,872 logic elements combined with 171 I/O pins provide designers the flexibility to implement mid-scale logic while supporting many external interfaces.
  • Compact Surface-Mount Package:  208-pin BFQFP package enables a dense PCB layout and is compatible with standard surface-mount assembly processes.
  • Standard 3.3 V System Compatibility:  3.0 V to 3.6 V supply range aligns with common 3.3 V digital ecosystems, simplifying power-rail integration.
  • On-Chip RAM for Local Buffering:  Approximately 0.063 Mbits of embedded RAM supports small FIFOs, lookup tables, and temporary data storage without external memory.
  • RoHS Compliant:  Meets lead-free process requirements for commercial product manufacturing.

Why Choose OR3T806S208-DB?

The OR3T806S208-DB positions itself as a practical, mid-density FPGA option for commercial designs that need a well-rounded mix of logic capacity, embedded memory, and a high I/O count in a compact surface-mount package. It is well suited to engineers implementing control logic, peripheral bridging, and configurable interfaces within standard 3.3 V systems.

Its combination of 3,872 logic elements, 63,488 bits of on-chip RAM, and 171 I/O pins delivers scalable capability for prototype and production designs while RoHS compliance supports contemporary manufacturing requirements.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical support for the OR3T806S208-DB.

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