OR3T806BA352I-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 298 63488 3872 352-BBGA |
|---|---|
| Quantity | 664 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-PBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BBGA | Number of I/O | 298 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 484 | Number of Logic Elements/Cells | 3872 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 63488 |
Overview of OR3T806BA352I-DB – ORCA™3C FPGA, 3872 Logic Elements, 298 I/O, 352-BBGA
The OR3T806BA352I-DB is an ORCA™3C field programmable gate array (FPGA) optimized for industrial embedded designs. It provides 3,872 logic elements, approximately 63,488 bits of on-chip RAM and up to 298 I/O pins in a 352-ball BGA package, supporting compact, high-density implementations.
With a 3.0–3.6 V supply range, industrial operating temperature rating (‑40 °C to 85 °C), and surface-mount 352-PBGA (35×35) package, this device is intended for applications that require robust operation and flexible I/O and memory resources.
Key Features
- Core Logic 3,872 logic elements and 116,000 equivalent gates provide the programmable fabric for custom logic functions and control algorithms.
- Embedded Memory Total on-chip RAM of 63,488 bits (approximately 0.063 Mbits) for data buffering, small FIFOs and state storage.
- I/O Density Up to 298 available I/O pins to support extensive sensor, actuator and external interface connectivity in a single device.
- Power and Supply Operates from a 3.0 V to 3.6 V supply range suitable for common industrial power domains.
- Package & Mounting 352-ball BGA (352-BBGA / 352-PBGA 35×35) in a surface-mount form factor for high-density board layouts.
- Industrial Temperature Range Rated for operation from ‑40 °C to 85 °C to meet many industrial environment requirements.
- Industrial Grade Specified as Industrial grade to align with embedded and industrial application needs.
Typical Applications
- Industrial Control Implement motor control, PLC logic, and real-time control functions using the device’s programmable logic and plentiful I/O.
- Factory Automation Interface with multiple sensors and actuators; use embedded RAM for short-term buffering and data handling.
- Communications Equipment Provide protocol bridging, parallel I/O expansion and custom interface logic leveraging the device’s I/O density.
- Test & Measurement Use the FPGA for custom timing, signal aggregation and preprocessing where deterministic logic and moderate memory are required.
Unique Advantages
- Balanced Logic and Memory: 3,872 logic elements combined with 63,488 bits of RAM deliver a practical mix for control and data buffering tasks without external memory in many applications.
- High I/O Count: 298 I/O pins reduce the need for additional I/O expanders and simplify board-level interface design.
- Industrial Temperature Capability: Rated from ‑40 °C to 85 °C to support deployment in industrial environments.
- Compact, High-Density Package: 352-ball BGA (35×35) enables high pin-count in a compact footprint for space-constrained boards.
- Standard Supply Range: 3.0–3.6 V operation matches common industrial power rails for straightforward system integration.
Why Choose OR3T806BA352I-DB?
The OR3T806BA352I-DB positions itself as a practical, industrial-grade FPGA option for embedded and control-focused designs that need moderate logic density, substantial I/O, and on-chip memory for buffering and state. Its combination of 3,872 logic elements, approximately 63,488 bits of RAM and 298 I/O pins supports a wide range of industrial applications while the 352-BBGA surface-mount package helps keep board area low.
Choose this device when you need a reliable programmable fabric that aligns with industrial temperature requirements and standard 3.0–3.6 V supply domains, offering a balance of integration, I/O capability, and compact packaging for production and prototyping alike.
Request a quote or contact sales to discuss availability, lead times and pricing for the OR3T806BA352I-DB.

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Headquarters: Hillsboro, Oregon, USA
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