OR3T557PS240-DB

The OR3T557PS240-DB is an ORCA™3C field programmable gate array (FPGA) offering a mid-density logic fabric with 2,592 logic elements and approximately 43,008 bits of embedded RAM. Designed as a surface-mount device in a 240-BFQFP exposed pad package, it provides a balance of I/O capacity and on-chip memory for compact, reconfigurable digital designs.

With 192 user I/Os, about 80,000 equivalent gates and a 3.0–3.6 V supply range, this FPGA targets applications that require moderate logic density, significant I/O connectivity, and commercial-temperature operation (0 °C to 70 °C).

Key Features

• Core Logic  2,592 logic elements delivering up to 80,000 equivalent gates for implementing custom digital functions.
• On-Chip Memory  Approximately 43,008 bits (≈0.043 Mbits) of embedded RAM to support buffering, small data tables, and state storage.
• I/O Capacity  192 user I/Os for broad connectivity to external devices, sensors, and interfaces.
• Power  Operates from a 3.0 V to 3.6 V supply range for compatibility with common system power rails.
• Package and Mounting  240-BFQFP exposed pad (supplier package: 240-SQFP2, 32×32) in a surface-mount form factor to support compact PCB layouts and thermal conduction through the exposed pad.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded Logic Integration  Implement custom control and glue logic where up to 2,592 logic elements and 192 I/Os are required.
• Interface Bridging  Use the device’s high I/O count to translate or aggregate signals between subsystems within the 3.0–3.6 V domain.
• Prototyping and Development  Deploy in development boards and proof-of-concept designs that require reprogrammable logic with modest on-chip RAM.

Unique Advantages

• Balanced Logic Density:  2,592 logic elements provide a mid-range resource set suitable for many control and glue-logic tasks without excessive board-level complexity.
• Substantial I/O Availability:  192 user I/Os enable flexible interfacing options for multi-signal designs, simplifying system routing and partitioning.
• Integrated On-Chip RAM:  Approximately 43,008 bits of embedded memory reduce the need for external RAM in small buffering and lookup scenarios.
• Compact Surface-Mount Package:  The 240-BFQFP exposed pad package supports compact PCB layouts while providing a thermal path through the exposed pad.
• Commercial-Grade Operation:  Specified for 0 °C to 70 °C operation to match a wide range of standard commercial applications.
• Standards-Aligned Compliance:  RoHS compliance supports environmentally responsible manufacturing and supply chain requirements.

Why Choose OR3T557PS240-DB?

The OR3T557PS240-DB delivers a practical combination of logic capacity, I/O density, and on-chip memory in a compact 240-BFQFP exposed pad package. Its 2,592 logic elements, 192 I/Os, and approximately 43,008 bits of RAM make it well suited for commercial embedded designs that require reconfigurable logic and substantial connectivity within a 3.0–3.6 V power envelope.

Choose this FPGA when you need a reprogrammable, RoHS-compliant device that balances resource availability and package compactness for prototyping, interface logic, and moderate-density digital designs.

Request a quote or submit an inquiry to discuss availability, pricing, and how OR3T557PS240-DB can fit your next design.