OR3T557BA352-DB

The OR3T557BA352-DB is an ORCA™3C family FPGA in a 352-BBGA package designed for commercial electronic designs. It integrates 2,592 logic elements, 43,008 bits of on-chip RAM and 288 I/O pins to implement custom digital logic in a surface-mount form factor.

With a 3.0 V to 3.6 V supply range, a commercial operating temperature range of 0 °C to 70 °C, and RoHS compliance, this device suits a range of commercial applications that require moderate logic capacity and substantial I/O connectivity.

Key Features

• Core Logic 2,592 logic elements and approximately 80,000 equivalent gates provide capacity for implementing custom combinational and sequential logic functions.
• Embedded Memory 43,008 bits of on-chip RAM (approximately 0.043 Mbits) for small data buffering, state storage, and local memory requirements.
• I/O Density 288 general-purpose I/O pins to support multiple external interfaces and parallel connectivity.
• Package & Mounting 352-BBGA package with supplier device package listed as 352-PBGA (35x35) and surface-mount assembly for compact board-level integration.
• Power Operates from a 3.0 V to 3.6 V supply to match common commercial power rails.
• Operating Range Commercial grade operation from 0 °C to 70 °C for typical consumer and commercial environments.
• Regulatory RoHS compliant for lead-free manufacturing and global environmental requirements.

Typical Applications

• Commercial Embedded Systems — Implement control logic and custom peripherals using the device's 2,592 logic elements and abundant I/O for connectivity.
• Prototyping and Development — Use the on-chip RAM and gate capacity to validate custom digital functions and interface prototypes in a compact surface-mount package.
• Interface Bridging and Glue Logic — 288 I/O pins provide flexibility to aggregate, translate, or steer signals between multiple subsystems on commercial PCBs.

Unique Advantages

• Balanced Logic and Memory — The combination of 2,592 logic elements and 43,008 bits of RAM supports moderate-complexity designs without external memory for many use cases.
• High I/O Count — 288 I/O pins allow direct connection to multiple peripherals and buses, reducing the need for external I/O expanders.
• Compact, Surface-Mount Package — 352-BBGA / 352-PBGA (35x35) packaging enables dense PCB layouts while maintaining a robust pin count.
• Commercial-Grade Reliability — Specified operating range of 0 °C to 70 °C and RoHS compliance align with standard commercial manufacturing and deployment requirements.
• Standard Supply Voltage — 3.0 V to 3.6 V operation simplifies integration with common commercial power systems.

Why Choose OR3T557BA352-DB?

The OR3T557BA352-DB offers a practical balance of programmable logic capacity, embedded memory, and extensive I/O in a compact BGA package for commercial electronic designs. Its specifications make it suitable for designers who need a moderate number of logic elements, substantial pin count, and on-chip RAM without stepping up to larger FPGA families.

This device is well suited to development teams and product designers focused on commercial embedded systems, interface consolidation, and prototype validation where straightforward integration, RoHS compliance, and surface-mount packaging are required.

Request a quote or submit an inquiry for pricing and availability of the OR3T557BA352-DB to evaluate it for your next commercial FPGA design.