OR3T307S208-DB

The OR3T307S208-DB is an ORCA® Series 3T field-programmable gate array (FPGA) offered by Lattice Semiconductor Corporation. It implements a mid-density FPGA architecture optimized for mixed-voltage system interfacing and flexible logic integration.

Designed for commercial-temperature applications, this device delivers 1568 logic elements, 25,600 bits of on-chip RAM, and 171 user I/Os in a 208-BFQFP surface-mount package, making it suitable for embedded logic, I/O bridging, and OEM integration where a compact, programmable solution is required.

Key Features

• Core Architecture — ORCA® Series 3T technology (0.3 μm, 4-level metal) with a device-class architecture derived from the ORCA Series 3 family.
• Logic Capacity — 1568 logic elements and 196 configurable logic blocks (CLBs) to implement medium-complexity digital functions and control logic.
• On-chip Memory — 25,600 total RAM bits of embedded memory for data buffering, state machines, and small lookup tables.
• I/O and Voltage Support — 171 user I/Os with support for mixed-voltage interconnection; device-level voltage supply range of 3.0 V to 3.6 V.
• Gate Count — Equivalent to 48,000 gates for capacity planning and system partitioning.
• Package and Mounting — 208-BFQFP (208-pin PQFP, 28 × 28 mm) in a surface-mount form factor for compact board designs.
• Operating Conditions — Commercial grade with operating temperature from 0 °C to 70 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Implement state machines, control logic, and custom interfaces where moderate logic density and on-chip RAM are required.
• Mixed-Voltage I/O Bridging — Use the device’s I/O capability and OR3T series mixed-voltage support to interface between 3.3 V and 5 V domains in consumer and industrial electronics.
• Glue Logic and Peripheral Integration — Replace discrete gate arrays and glue logic with programmable logic to consolidate functions and reduce BOM in OEM products.

Unique Advantages

• Balanced Logic and Memory — 1568 logic elements paired with 25,600 bits of embedded RAM provide a practical balance for control and buffering tasks without overprovisioning.
• Significant I/O Count — 171 user I/Os enable rich peripheral connectivity and flexible board-level interfacing.
• Surface-Mount PQFP Package — 208-BFQFP packaging supports compact board layouts while providing ample pin access for I/O-intensive designs.
• Commercial Temperature Suitability — Rated for 0 °C to 70 °C operation to match mainstream consumer and commercial product requirements.
• Regulatory Friendly — RoHS compliance supports environmental and supply-chain requirements for lead-free assembly.

Why Choose OR3T307S208-DB?

The OR3T307S208-DB positions itself as a practical, mid-density FPGA option within the ORCA® Series 3T family, offering a clear balance of logic resources, embedded memory, and a high I/O count in a compact 208-pin PQFP package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of consumer and OEM applications that require programmable integration without high-end thermal or automotive qualification.

This device is well suited to engineers and product teams looking to consolidate discrete logic, implement custom peripheral interfaces, or add flexible I/O bridging between voltage domains while keeping board-level real estate and BOM complexity under control.

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